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Crystal oscillator and production method of crystal oscillator

A crystal oscillator and chip technology, applied in the electronic field, can solve problems such as chip conductive upper cover collision short circuit, mobile phone timing disorder, short circuit, etc., and achieve the effect of simple method

Inactive Publication Date: 2016-09-21
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the problem in the prior art that the chip is easy to collide with the conductive upper cover and short circuit during the process of falling and rolling, the embodiment of the present invention provides a crystal oscillator and its production method, which can effectively insulate the wafer and the conductive upper cover. , to prevent the chip from colliding with the conductive upper cover to cause a short circuit to the ground, which will lead to bad phenomena such as disordered timing of the mobile phone
[0006] In the crystal oscillator provided by the embodiment of the present invention, the chip is insulated from the conductive upper cover through the insulating varnish on the preset position, which effectively solves the short circuit to the ground caused by the collision between the chip and the conductive upper cover during the process of dropping or rolling. As a result, the mobile phone timing disorder and other undesirable problems

Method used

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  • Crystal oscillator and production method of crystal oscillator
  • Crystal oscillator and production method of crystal oscillator
  • Crystal oscillator and production method of crystal oscillator

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Embodiment 1

[0035] figure 2 A schematic structural diagram of the crystal oscillator provided for the embodiment of the present invention, such as figure 2 As shown, a crystal oscillator provided by the present invention includes a base 3, a conductive upper cover 1 disposed on the top of the base 3, a wafer 2 disposed in the base 3, and two pads 4 disposed on the bottom of the base 3 , the base 3 is provided with an accommodating chamber 5 under the conductive upper cover 1, and the bottom of the accommodating chamber 5 is provided with two connecting pads 6 correspondingly connected with the pads 4, and the chip 2 is arranged in the accommodating In the cavity 5, the surface of the wafer 2 is provided with an electrode 8 connected to one of the connection pads 6, wherein the bottom surface of the conductive upper cover 1 is provided with a preset position 7 above the wafer 2, and the preset position 7 Coated with insulating varnish. The insulating varnish on the preset position 7 in...

Embodiment 2

[0037] image 3 A schematic flow diagram of a crystal oscillator manufacturing method provided by an embodiment of the present invention; Figure 4 It is a schematic flow chart of the steps of making a synthetic crystal into a wafer in the crystal oscillator manufacturing method provided by the embodiment of the present invention.

[0038] Such as figure 2 Shown, a kind of manufacturing method of crystal oscillator provided by the present invention, it comprises:

[0039] In step 301, the synthetic crystal is made into a wafer 2;

[0040] Step 302 plating a metal layer on the surface of the wafer 2 to form an electrode 8, and making the thickness of the metal layer reach a preset range;

[0041] Step 303 fixes the wafer 2 on which the electrode 8 has been formed in the accommodating cavity 5 of the base 3, and solidifies the wafer 2;

[0042] Step 304 adjusts the thickness of the electrode 8 on the surface of the wafer 2 so that the frequency of the crystal oscillator mee...

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Abstract

The invention provides a crystal oscillator and a production method of the crystal oscillator. The crystal oscillator comprises a base, a conductive upper cover arranged on the top of the base, a crystal plate arranged in the base and two pads arranged at the bottom of the base. The base is equipped with a containing cavity located under the conductive upper cover. Two connection welding spots arranged at the bottom of the containing cavity are correspondingly connected with the pads. The crystal plate is arranged in the containing cavity. An electrode arranged on the surface of the crystal plate is connected with one of the connection welding spots. A preset position is arranged on the bottom surface of the conductive upper cover and is located above the crystal plate. Insulation paint is coated at the preset position. Through adoption of the insulation paint at the preset position, the crystal plate and the conductive upper cover are insulated; and the bad problems such as disordered time sequence of a mobile phone due to the short circuit over the ground are effectively solved. The short circuit over the ground results from collision of the crystal plate and the conductive upper cover in the fall-off and rolling processes.

Description

technical field [0001] The invention relates to the field of electronics, in particular to a crystal oscillator and a manufacturing method thereof. Background technique [0002] Crystal oscillator is the collective name of quartz crystal resonators and quartz crystal oscillators. It is made of quartz crystal plates with piezoelectric effect. Its function is to generate the original clock frequency, which is different after being enlarged or reduced by different frequency generators. the bus frequency. Because the crystal oscillator has the advantages of small size, light weight, high reliability, and high frequency stability, it is used in consumer electronics such as mobile phones and pads. [0003] The structure of the current crystal oscillator is as follows figure 1 As shown, it includes a base, a conductive upper cover on the top of the base, a chip inside the base, and two pads on the bottom of the base, and the base is provided with an accommodating cavity under the...

Claims

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Application Information

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IPC IPC(8): H03H3/02H03H9/19
CPCH03H3/02H03H9/19
Inventor 孙学彪吉圣平李明周伟杰羿冬冬
Owner VIVO MOBILE COMM CO LTD