Crystal oscillator and production method of crystal oscillator
A crystal oscillator and chip technology, applied in the electronic field, can solve problems such as chip conductive upper cover collision short circuit, mobile phone timing disorder, short circuit, etc., and achieve the effect of simple method
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Embodiment 1
[0035] figure 2 A schematic structural diagram of the crystal oscillator provided for the embodiment of the present invention, such as figure 2 As shown, a crystal oscillator provided by the present invention includes a base 3, a conductive upper cover 1 disposed on the top of the base 3, a wafer 2 disposed in the base 3, and two pads 4 disposed on the bottom of the base 3 , the base 3 is provided with an accommodating chamber 5 under the conductive upper cover 1, and the bottom of the accommodating chamber 5 is provided with two connecting pads 6 correspondingly connected with the pads 4, and the chip 2 is arranged in the accommodating In the cavity 5, the surface of the wafer 2 is provided with an electrode 8 connected to one of the connection pads 6, wherein the bottom surface of the conductive upper cover 1 is provided with a preset position 7 above the wafer 2, and the preset position 7 Coated with insulating varnish. The insulating varnish on the preset position 7 in...
Embodiment 2
[0037] image 3 A schematic flow diagram of a crystal oscillator manufacturing method provided by an embodiment of the present invention; Figure 4 It is a schematic flow chart of the steps of making a synthetic crystal into a wafer in the crystal oscillator manufacturing method provided by the embodiment of the present invention.
[0038] Such as figure 2 Shown, a kind of manufacturing method of crystal oscillator provided by the present invention, it comprises:
[0039] In step 301, the synthetic crystal is made into a wafer 2;
[0040] Step 302 plating a metal layer on the surface of the wafer 2 to form an electrode 8, and making the thickness of the metal layer reach a preset range;
[0041] Step 303 fixes the wafer 2 on which the electrode 8 has been formed in the accommodating cavity 5 of the base 3, and solidifies the wafer 2;
[0042] Step 304 adjusts the thickness of the electrode 8 on the surface of the wafer 2 so that the frequency of the crystal oscillator mee...
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