Crystal oscillator and production method thereof

Abstract

The invention provides a crystal oscillator and a production method thereof. The crystal oscillator comprises a base, a conductive upper cover arranged on the top of the base, a crystal plate arranged in the base and two pads arranged at the bottom of the base. The base is equipped with a containing cavity located under the conductive upper cover. Two connection welding spots arranged at the bottom of the containing cavity are correspondingly connected with the pads. The crystal plate is arranged in the containing cavity. An electrode arranged on the surface of the crystal plate is connected with one of the connection welding spots. A preset position is arranged on the bottom surface of the conductive upper cover and is located above the crystal plate. Insulation paint is coated at the preset position. Through adoption of the insulation paint at the preset position, the crystal plate and the conductive upper cover are insulated; the method is simple; and the bad problems such as disordered time sequence of a mobile phone due to the short circuit over the ground are effectively solved. The short circuit over the ground results from collision of the crystal plate and the conductive upper cover in the fall-off and rolling processes.

Description

Technical field [0001] The invention relates to the field of electronics, in particular to a crystal oscillator and its manufacturing method. Background technique [0002] Crystal oscillator is the collective name of quartz crystal resonator and quartz crystal oscillator. It is made of quartz crystal with piezoelectric effect. Its function is to generate the original clock frequency, which is different after being amplified or reduced by different frequency generators. Bus frequency. Because the crystal oscillator has the advantages of small size, light weight, high reliability, and high frequency stability, it is used in consumer electronics such as mobile phones and pads. [0003] The current crystal structure is as figure 1 As shown, it includes a pedestal, a conductive upper cover arranged on the top of the pedestal, a chip arranged in the pedestal, and two pads arranged on the bottom of the pedestal. The pedestal is provided with a receiving cavity under the conductive upper ...

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Problems solved by technology

[0004] In order to overcome the problem in the prior art that the chip is easy to collide with the conductive upper cover and short circuit during the process of falling and rolling, the embodiment of the present invention provides a crystal oscillator and its production method, which can effectively insulate the wafer and the conductive upper cover. , to prevent the chip from colliding with the conductive upper cover to cause a short circuit to the ground, which will lead to bad phenomena such as disordered timing of the mobile phone

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