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Beam shaping mask, laser processing device, and laser processing method

A laser processing method and beam shaping technology, applied in the field of laser processing devices and laser processing, can solve the problems of cutting residue, inability to form with good precision, uneven intensity distribution, etc.

Inactive Publication Date: 2016-09-28
V TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, in such a conventional beam shaping mask, the above-mentioned pattern is an opening having a shape similar to the aperture formed on the film, and since the light transmittance in the opening is constant throughout the entirety, the light transmittance in the opening may be changed when using the transmittance. Cutting residue (hereinafter referred to as "burr") occurs at the edge of the aperture where the patterned (opening) laser passes through the film and is processed due to uneven in-plane intensity distribution of the laser.
Therefore, fine through-holes with the above-mentioned pore diameters cannot be precisely formed on the film.

Method used

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  • Beam shaping mask, laser processing device, and laser processing method
  • Beam shaping mask, laser processing device, and laser processing method
  • Beam shaping mask, laser processing device, and laser processing method

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Embodiment Construction

[0017] Hereinafter, embodiments of the present invention will be described in detail based on the drawings. figure 1 It is a figure which shows one embodiment of the beam shaping mask of this invention, figure 1 (a) is a top view, figure 1 (b) is figure 1 (a) The O-O line sectional plane view. in addition, figure 2 It is a figure explaining the light transmittance in the opening of the beam shaping mask of this invention, figure 2 (a) is a graph showing an example of the light transmittance characteristic along the center line in the opening, figure 2 (b) is an explanatory diagram showing halftones, figure 2 (c) means figure 2 (b) is an explanatory diagram of an example of halftone formation. This beam shaping mask 1 has an opening similar to the shape of a hole to be processed by laser processing, and is configured to include a transparent substrate 2 , a light-shielding film 3 , and an opening 4 .

[0018] The above-mentioned transparent substrate 2 is, in parti...

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Abstract

A beam shaping mask (1) having apertures (4) similar in shape to that of an aperture pattern (20) formed by laser processing a film (15), wherein the apertures (4) are formed such that the optical transmittance within the apertures (4) gradually decreases from the center toward the edges of the apertures, and such that the optical transmittance at the edges of the apertures is capable of ensuring at least the minimal laser intensity capable of laser processing the film (15). Thus, it is possible to prevent burrs (22) from being generated at the edges of the holes after laser processing is performed.

Description

technical field [0001] The present invention relates to a beam shaping mask having an opening similar to the shape of a hole machined by laser on an object to be processed, and more particularly to a beam shaping mask intended to prevent burrs from being generated at the edge of the laser machined hole. Die, laser processing device and laser processing method. Background technique [0002] In the past, such a beam shaping mask is a mask used in a projection imaging laser ablation system, which has a pattern similar to the aperture formed on a flexible film. By imaging the pattern on the above-mentioned film, the film After laser ablation, pores with the above-mentioned pore size are formed in the thin film (for example, refer to Patent Document 1). [0003] Patent Document 1: Japanese Patent Laid-Open Publication No. 2005-517810 [0004] However, in such a conventional beam shaping mask, the above-mentioned pattern is an opening having a shape similar to the aperture forme...

Claims

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Application Information

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IPC IPC(8): B23K26/066B23K26/382
CPCB23K26/066B23K26/382B23K2103/42
Inventor 水村通伸
Owner V TECH CO LTD