Artificial graphite flake and manufacturing method thereof, and graphite substrate stack structure containing artificial graphite flake

A technology of artificial graphite sheet and manufacturing method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems that the heat dissipation substrate cannot effectively meet the thermal diffusion and heat conduction, the life of high-power LEDs is limited, and it is difficult to use long-term and normal. Achieve the effects of improving production yield and flatness, reducing easy cracking, and increasing adhesion

Active Publication Date: 2016-10-05
柯品聿
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  • Abstract
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  • Application Information

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Problems solved by technology

[0003] With the advancement of technology, various high-power and high-efficiency 3C electronic products have emerged accordingly. While improving performance, various hardware accessories have higher and higher requirements for heat dissipation; for high-power LEDs, Because the high wattage will generate hig...

Method used

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  • Artificial graphite flake and manufacturing method thereof, and graphite substrate stack structure containing artificial graphite flake
  • Artificial graphite flake and manufacturing method thereof, and graphite substrate stack structure containing artificial graphite flake
  • Artificial graphite flake and manufacturing method thereof, and graphite substrate stack structure containing artificial graphite flake

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Embodiment Construction

[0043] see figure 1 , it can be seen that the main process of the manufacturing method of the artificial graphite sheet in the embodiment of the present invention includes stacking step S1, the first heating step S2, the second heating step S3 and rolling, forming S4 and other processes; of course, before stacking, it will be selected first. The predetermined material PI film (polyimide film) is cut into a preset size specification, and then enters the stacking step S1, wherein the thickness of the material PI film used above is preferably between 10-200um.

[0044] Stacking step S1, which is mainly to cross-stack the PI film and natural graphite dust paper, so that each PI film is between two natural graphite dust papers; for the state of stacking, please refer to Figure 4 , which is to stack the PI film 20' and the natural graphite dust paper 12 to a preset number of layers or height, separate them with at least two graphite plates 11 and press them on and below them, and p...

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Abstract

The invention provides an artificial graphite flake and a manufacturing method thereof. The artificial graphite flake is prepared from a PI membrane through a stacking step, a first heating step and a second heating step; and the artificial graphite flake is improved in lubricity, hardness, balanced heating in thermal conduction and flatness. Moreover, a through hole perforation step is further carried out so as to form a porous structure on the artificial graphite flake, which enables the diffusion area, air permeability, production yield and flatness of the artificial graphite flake to be improved. The invention also relates to a graphite substrate stack structure containing the artificial graphite flake. The graphite substrate stack structure comprises the prepared artificial graphite flake, a substrate, at least one conducting layer and at least one insulating layer and is applicable to thermoelectric separation electronics.

Description

technical field [0001] The invention relates to a method for manufacturing a graphite sheet, in particular to a method for manufacturing an artificial graphite sheet, and also relates to a graphite substrate containing the artificial graphite sheet. Background technique [0002] The circuit substrates used in electronic products are usually made of materials with good thermal conductivity in order to dissipate the heat generated during operation in a timely manner and maintain good operating performance to meet the needs of electronic products. [0003] With the advancement of technology, various high-power and high-efficiency 3C electronic products have emerged accordingly. While improving performance, various hardware accessories have higher and higher requirements for heat dissipation; for high-power LEDs, Because the high wattage will generate higher heat during operation, the existing heat dissipation substrates can no longer effectively meet the problems of heat diffus...

Claims

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Application Information

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IPC IPC(8): C01B31/04H01L33/64
Inventor 柯品聿
Owner 柯品聿
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