Full layout structure of package substrate

Abstract

A whole layout structure of a package substrate is provided, including a plate having a plurality of substrate units, a frame body surrounding the periphery of the plate, the frame body being constituted by a plurality of metal blocks and an insulating material formed between each of the metal blocks, wherein the insulating material extends inward from an outer edge of the frame body so that the layout route can be designed in a non-linear manner to enhance the strength and rigidity of the frame structure in order to prevent brittle and splitting on its outward edge and thus improve reliability and good yield of the whole layout structure.

Description

technical field [0001] The invention relates to a package substrate, in particular to a full layout structure of the package substrate. Background technique [0002] With the evolution of semiconductor technology, semiconductor products have developed different types of packaging products. Due to the substantial growth of various portable (Portable) products such as communications, networks and computers, the area of ​​integrated circuits (IC) can be reduced and has high The ball grid array package (BGA) with density and multi-pin characteristics has gradually become the mainstream in the packaging market, and is often matched with high-performance chips such as microprocessors, chipsets, and graphics chips to play Higher speed calculation function. [0003] The BGA is an advanced semiconductor chip packaging technology, which is characterized in that a semiconductor chip is placed on a package substrate, and a plurality of solder balls (Solder Ball) arranged in a grid arra...

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Problems solved by technology

[0006] However, the route of the glue material 102 extending inward from the outer edge 10a of the frame body 10 is a straight line, so when the clamps 9a, 9b clamp the frame body 10 under too much pressure, the frame body 10 is easy to dislodge from its The part of the adhesive material 102 with insufficient structural strength and toughness produces linear brittle (brittle) inwardly along the outer edge 10a of the frame body 10, such as Figure 1C As shown, the crack may even extend to the plate 1a, thereby damaging the circuits in the substrate unit 11, and further reducing the reliability and yield of the full layout structure 1.

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