Unlock instant, AI-driven research and patent intelligence for your innovation.

Embedded light emitting diode circuit board and manufacturing method thereof

一种发光二极管、制作方法的技术,应用在电路、印刷电路、印刷电路等方向,能够解决电路板50不利安装、增加整体产品厚度等问题

Inactive Publication Date: 2016-10-05
LONGMEN GETMORE POLYURETHANE
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] But when this LED60 is arranged on the top surface 52 of this circuit board 50 by the above-mentioned method, because this LED60 itself has height, make this LED60 protrude from the top surface 52 of this circuit board 50, and then increase the thickness of whole product, cause this circuit Board 50 is unfavorable for installation in electronic devices with relatively small space

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Embedded light emitting diode circuit board and manufacturing method thereof
  • Embedded light emitting diode circuit board and manufacturing method thereof
  • Embedded light emitting diode circuit board and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] Embodiments of the present invention will now be described with reference to the drawings, in which like reference numerals represent like elements.

[0041] see figure 1 As shown, the present invention provides a kind of manufacturing method of embedded light-emitting diode (LED) circuit board, and this manufacturing method comprises the following steps:

[0042] S11, forming a through hole on a circuit substrate, and the through hole communicates with a first surface and a second surface opposite to the circuit substrate;

[0043] S12, embedding an LED in the through hole of the circuit substrate; and

[0044] S13, connecting the two pins of the LED with a circuit on the second surface of the circuit substrate.

[0045] When actually manufacturing embedded LED circuit boards, multiple circuit substrates are arranged in a matrix, and the processing operations of these circuit substrates are performed simultaneously to save production time. Each of the circuit subst...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses an embedded light emitting diode (LED) circuit board and a manufacturing method thereof. The manufacturing method comprises a step of forming a hole in a circuit substrate, wherein the hole communicates with opposite first surface and second surface of the circuit substrate, a step of burying an LED in the hole of the circuit substrate, and a step of connecting two pins of the LED and a line on the second surface of the circuit substrate. Compared with prior art, since the LED is arranged in the hole of the circuit substrate and is not arranged at the surface of the circuit substrate, thus the LED is embedded into the circuit substrate, the thickness of the LED circuit board is reduced further, and the installation of the LED circuit board in an electronic device with a limited volume is facilitated.

Description

technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, in particular to an embedded light-emitting diode circuit board and a manufacturing method thereof. Background technique [0002] see Figure 8 As shown, when installing a light-emitting diode 60 (LED) on the circuit board 50 of the prior art, the circuit board 50 is formed with two through holes 51 earlier, and the LED60 is arranged on the top surface 52 of the circuit board 50. The LED60 The two pins 61 respectively penetrate the two through holes 51 from the top surface 52 of the circuit board 50, extend out from the bottom surface 53 of the circuit board 50, and then bend and weld with the circuit 54 on the bottom surface 53 of the circuit board 50. In this way, the LED 60 is disposed on the top surface 52 of the circuit board 50 , and the LED 60 can be electrically connected to the circuit 54 on the bottom surface 53 of the circuit board 50 to be energized and emit light....

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30H05K3/32H05K1/18
CPCH05K1/182H05K2201/10022H05K2201/10106H05K2201/10522H01L2933/0033H01L33/483H01L33/62H05K1/18H05K3/30H05K3/32H01L33/005
Inventor 林嘉彦
Owner LONGMEN GETMORE POLYURETHANE