Embedded light emitting diode circuit board and manufacturing method thereof
一种发光二极管、制作方法的技术,应用在电路、印刷电路、印刷电路等方向,能够解决电路板50不利安装、增加整体产品厚度等问题
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[0040] Embodiments of the present invention will now be described with reference to the drawings, in which like reference numerals represent like elements.
[0041] see figure 1 As shown, the present invention provides a kind of manufacturing method of embedded light-emitting diode (LED) circuit board, and this manufacturing method comprises the following steps:
[0042] S11, forming a through hole on a circuit substrate, and the through hole communicates with a first surface and a second surface opposite to the circuit substrate;
[0043] S12, embedding an LED in the through hole of the circuit substrate; and
[0044] S13, connecting the two pins of the LED with a circuit on the second surface of the circuit substrate.
[0045] When actually manufacturing embedded LED circuit boards, multiple circuit substrates are arranged in a matrix, and the processing operations of these circuit substrates are performed simultaneously to save production time. Each of the circuit subst...
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