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Electronic heat dissipation device made from rare metal

A rare metal, heat sink technology, applied in electrical digital data processing, instruments, digital data processing parts and other directions, can solve the problems of incomplete functions, unsafe operation, complex structure, etc., to achieve comprehensive functions, scientific and reasonable structure, Small size effect

Inactive Publication Date: 2016-10-12
天津瑞鑫科技咨询有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The object of the present invention is to provide an electronic cooling device based on the synthesis of rare metals to solve the problems of unsafe operation, complex structure, troublesome work, incomplete functions, large volume and waste in the above-mentioned background technology

Method used

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  • Electronic heat dissipation device made from rare metal

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Embodiment Construction

[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0014] see figure 1 , the present invention provides a technical solution: Invention: An electronic cooling device based on rare metal synthesis, including a power supply 1, support feet 7 and an outer shell 15, the outer shell 15 is provided with a heat dissipation port 14, and the outer shell 15 The right side is provided with a switch button 12, the bottom of the switch button 12 is provided with a USB interface 9, the power supply 1 is installed inside the...

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Abstract

The invention discloses an electronic heat dissipation device made from rare metal. The electronic heat dissipation device includes a power source, support feet, and a housing; a heat dissipation opening is formed in the housing, and the right side of the housing is provided with a switch button; an electromagnetic door, USB interfaces, a compressor, a switch button, an optical disc driver, a servo motor and a main control circuit are electrically to the power source. Compared with prior art, the electronic heat dissipation device has the beneficial effects: the electronic heat dissipation device is scientific and reasonable in structure, is safe and convenient to operate, is simple in structure, is fast and convenient in working, is powerful in function, is small in size, is provided with a Freon chamber, the compressor, an inserting steel tube sheet and a condenser tube, can dissipate heat through a refrigeration effect of the Freon which can be reused, can dissipate heat efficiently, and is provided with a spring hydraulic device which can remove dust on a baffle plate; and the electronic heat dissipation device is easy to use, and can save time and labors.

Description

technical field [0001] The invention belongs to the technical field of computer mainframes, and in particular relates to an electronic cooling device based on rare metal synthesis. Background technique [0002] The computer host refers to the main body part of the computer except the input and output devices. It is also a control box for placing the main board and other main components. Usually includes CPU, memory, hard disk, optical drive, power supply, and other input and output controllers and interfaces. In network technology, it is a terminal device about sending and receiving information. Refers to the container used to place the motherboard and other major components in the computer hardware system. Usually includes CPU, memory, hard disk, optical drive, power supply, and other input and output controllers and interfaces, such as USB controllers, graphics cards, network cards, sound cards, and so on. Those located inside the main chassis are usually called intern...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20
Inventor 刘宝玲
Owner 天津瑞鑫科技咨询有限公司
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