Array substrate and its preparation method

Abstract

The invention discloses an array substrate and a preparation method thereof. The method comprises the following steps that an amorphous silicon film layer of preset thickness is deposited on the surface of a substrate through a coating process; the substrate where the amorphous silicon film layer is deposited is subjected to edge exposure, and the portion, located in an edge film thickness transition area at the edge position of the surface of the substrate, of the amorphous silicon film layer is removed through an etching process; a crystallization process is carried out on the amorphous silicon film layer, and the amorphous silicon film layer is converted into a polycrystalline silicon film layer. Thus, the problem that a traditional substrate is poor in subsequent packaging due to the fact that the thickness of a polycrystalline silicon film layer on the edge of the surface of the substrate is uneven is solved.

Description

technical field [0001] The present invention relates to the technical field of semiconductors, in particular to an array substrate and a preparation method thereof. Background technique [0002] At present, when preparing substrates (such as low-temperature polysilicon substrates), in order to obtain the maximum number of surfaces, the UV (Ultraviolet Rays, shadowless glue) sealing area is usually arranged in the non-film-forming guaranteed area on the edge of the substrate. However, since the silicon thin film deposited on the surface of the substrate is formed into a film, the thickness of the silicon thin film at the edge of the substrate generally gradually transitions from zero to the target thickness. That is, the thickness of the film deposited on the surface of the substrate is not uniform between the non-film-forming-guaranteed area and the film-forming-guaranteed area at the edge of the substrate, but gradually increases to the target thickness. Therefore, when th...

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Problems solved by technology

[0003] Based on this, it is necessary to provide an array substrate and its preparation method for the problem that the traditional array substrate is easy to cause poor device packaging.

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