Leadless LED package structure

Abstract

The invention provides a comprises a leadless LED package structure which comprises a package body, a control module, and multiple LED chips, wherein the package body is in the shape of a truncated cone and has upper and lower bottom surfaces and a side surface, the area of the upper bottom surface is smaller than that of the lower bottom surface, the multiple LED chips are uniformly distributed at the side face of the package body, through the circuit pattern on the side face, the multiple LED chips are connected in series and / or parallel, a lamp string is formed, and terminals at two ends of the lamp string are electrically connected to the control module through the internal conductive layer in the package body. The upper bottom surface of the package body has a blind hole, and the shape of the control module and the shape of the blind hole are complementary with each other, and the control module can be embedded into the blind hole.

Description

technical field [0001] The invention relates to the field of solid-state lighting materials, in particular to a leadless LED packaging structure. Background technique [0002] The semiconductor light-emitting elements currently used are mainly LEDs (light-emitting diodes). LEDs are solid-state semiconductor devices that can directly convert electrical energy into light energy. Compared with traditional incandescent lamps and fluorescent lamps, white LEDs have the advantages of low power consumption, high luminous efficiency, long service life, energy saving and environmental protection, so they can not only be widely used in the field of daily lighting, but also enter the field of display equipment. [0003] The current LED packaging is mainly COB (chip on board) packaging structure, that is, the LED is fixed on the substrate (flat substrate) by wire bonding, and then packaged with fluorescent glue, but it has the following disadvantages: 1) Planar light emission is not cond...

AI Technical Summary

Problems solved by technology

[0003] The current LED packaging is mainly COB (chip on board) packaging structure, that is, the LED is fixed on the substrate (flat substrate) by wire bonding, and then packaged with fluorescent glue, but it has the following disadvantages: 1) Planar light emission is not conducive to With the expansion of the light emission angle, the distribution of LED chips is denser; 2) The wiring is more cumbersome and prone to poor electrical connections; 3) The connection of the control chip is single, and it is not easy to replace and maintain

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