Leadless LED package structure

[0019] See figure 1 The present invention first provides a leadless LED package structure, including a package body 1, a control module 3, and a plurality of LED chips 2. The package body 1 is in the shape of a truncated cone with upper and lower bottom surfaces and side surfaces. The area of ​​the upper bottom surface Less than the area of ​​the lower bottom surface, the plurality of LED chips 2 are evenly distributed on the side surface of the package body 1, and the plurality of LED chips 2 are connected in series and/or parallel through the circuit pattern 9 on the side surface to form a light string. The terminals at both ends of the light string are electrically connected to the control module 3 through the inner conductive layer 4 of the package body 1.

[0020] The upper bottom surface of the package body 1 has a blind hole, the blind hole is cylindrical, the shape of the control module 3 is complementary to the blind hole, and is just embedded in the blind hole, and the bottom of the blind hole exposes part of the internal conductive layer 4; The package body is a ceramic material with good heat dissipation and is manufactured through an integral molding process, and the conductive pattern is formed on the side surface through processes such as electroplating and photolithography. The side surface of the package body 1 forms a certain angle with the lower bottom surface, and the range of the angle is between 30-75 degrees.

[0021] The inner conductive layer 4 is electrically connected to the conductive pattern 9 and is electrically connected to the light string through the conductive pattern 9. A portion of the inner conductive layer 4 is exposed at the bottom of the blind hole of the body 1; the inner conductive layer 4 The formation method is as follows: drilling a hole in the body 1 and injecting a conductive material to solidify.

[0022] The control module 3 is cylindrical and includes a control chip 5, a through hole 6, a conductive terminal 8 and a resin molded body. The control chip 5 is surrounded by the resin molding body, and the terminals of the control chip 5 are exposed at the bottom of the resin molding compound. The terminals are connected to the internal conductive layer 4 at the bottom of the blind hole; the control chip 3 has electrical The through hole 6 connecting the control chip 3 and the conductive terminal 8 is provided in the resin molding compound. The resin molding compound has a groove 7 on the top surface, and the groove 7 exposes the conductive terminal 8. The groove 7 can accommodate a battery, and can also be inserted into other external power sources or parts with other functions (except for control functions). . The control module is pluggable, which can be unplugged or inserted at any time, which is convenient for replacement and maintenance.

[0023] The multiple LED chips are flip-chips, which may be multiple LED chips that emit light of the same color, or may be LED chips that emit light of different colors, which are arranged on the side surface with an equal distance apart. This arrangement makes light emission uniform.

[0024] Finally, it should be noted that: Obviously, the above-mentioned embodiments are merely examples for clearly illustrating the present invention, rather than limiting the implementation manners. For those of ordinary skill in the art, other changes or changes in different forms can be made on the basis of the above description. There is no need and cannot give an exhaustive list of all implementation methods. The obvious changes or modifications derived from this are still within the protection scope of the present invention.