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Leadless LED package structure

A LED packaging, leadless technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of cumbersome wiring, difficult replacement and maintenance, unfavorable expansion of light emission angle, etc., to improve luminous efficiency and facilitate replacement. and repair effect

Active Publication Date: 2016-10-12
佛山市鑫迪电子科技有限公司
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AI Technical Summary

Problems solved by technology

[0003] The current LED packaging is mainly COB (chip on board) packaging structure, that is, the LED is fixed on the substrate (flat substrate) by wire bonding, and then packaged with fluorescent glue, but it has the following disadvantages: 1) Planar light emission is not conducive to With the expansion of the light emission angle, the distribution of LED chips is denser; 2) The wiring is more cumbersome and prone to poor electrical connections; 3) The connection of the control chip is single, and it is not easy to replace and maintain

Method used

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  • Leadless LED package structure

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Embodiment Construction

[0019] see figure 1 , the present invention firstly provides a leadless LED package structure, including a package body 1, a control module 3, and a plurality of LED chips 2, wherein the package body 1 is in the shape of a circular truncated cone, which has upper and lower bottom surfaces and side surfaces, and the area of ​​the upper bottom surface is Smaller than the area of ​​the lower bottom surface, the plurality of LED chips 2 are evenly distributed on the side of the package body 1, and the plurality of LED chips 2 are connected in series and / or in parallel through the circuit pattern 9 on the side to form a light string, and The terminals at both ends of the light string are electrically connected to the control module 3 through the inner conductive layer 4 of the package body 1 .

[0020] The upper bottom surface of the package body 1 has a blind hole, the blind hole is cylindrical, the shape of the control module 3 is complementary to the blind hole, just embedded in...

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Abstract

The invention provides a comprises a leadless LED package structure which comprises a package body, a control module, and multiple LED chips, wherein the package body is in the shape of a truncated cone and has upper and lower bottom surfaces and a side surface, the area of the upper bottom surface is smaller than that of the lower bottom surface, the multiple LED chips are uniformly distributed at the side face of the package body, through the circuit pattern on the side face, the multiple LED chips are connected in series and / or parallel, a lamp string is formed, and terminals at two ends of the lamp string are electrically connected to the control module through the internal conductive layer in the package body. The upper bottom surface of the package body has a blind hole, and the shape of the control module and the shape of the blind hole are complementary with each other, and the control module can be embedded into the blind hole.

Description

technical field [0001] The invention relates to the field of solid-state lighting materials, in particular to a leadless LED packaging structure. Background technique [0002] The semiconductor light-emitting elements currently used are mainly LEDs (light-emitting diodes). LEDs are solid-state semiconductor devices that can directly convert electrical energy into light energy. Compared with traditional incandescent lamps and fluorescent lamps, white LEDs have the advantages of low power consumption, high luminous efficiency, long service life, energy saving and environmental protection, so they can not only be widely used in the field of daily lighting, but also enter the field of display equipment. [0003] The current LED packaging is mainly COB (chip on board) packaging structure, that is, the LED is fixed on the substrate (flat substrate) by wire bonding, and then packaged with fluorescent glue, but it has the following disadvantages: 1) Planar light emission is not cond...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/54H01L33/62
CPCH01L25/0753H01L33/54H01L33/62
Inventor 王汉清
Owner 佛山市鑫迪电子科技有限公司
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