Drilling method of flexible circuit board
A technology of flexible circuit board and drilling method, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., to achieve the effect of easy size
Inactive Publication Date: 2016-10-12
欣兴同泰科技(昆山)有限公司
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Problems solved by technology
But at present, for double-sided FPC, its thickness requirement is no more than 29.4 μm, and the aspect ratio (aspect ratio = plate thickness / minimum aperture) must be less than or equal to 1.2. Therefore, the minimum through hole aperture needs to be controlled at 35 μm~ 25μm, and the existing technology cannot achieve the above purpose
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[0020] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0021] like figure 1 As shown, the present invention provides a method for drilling a linear circuit board, and specifically includes the following steps:
[0022] First, a substrate is provided, which can be a single-layer double-sided board or a multi-layer double-sided board. Of course, the surface of the substrate is a copper layer, that is to say, the substrate referred to in the present invention is a copper-clad substrate.
[0023] Then, according to production requirements, holes are drilled on...
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Abstract
The invention discloses a drilling method of a flexible circuit board. The drilling method comprises the steps as follows: a substrate is provided; the copper thickness on the surface of the substrate is controlled to be smaller than or equal to 8 microns; laser drilling is carried out on the position, which needs to be conducted, on the substrate by ultraviolet light; the ratio of the aperture of a drilled through hole to the thickness of the substrate is smaller than or equal to 1.2; residues left during drilling are eliminated; a carbon film is formed in the area, in which non-copper foil is located, on the wall of the drilled through hole; and copper plating is carried out on the through hole. The copper thickness on the substrate is controlled to be smaller than 8 microns, so that subsequent drilling is easier to achieve and the size of the through hole is easier to control. The size of the through hole can be accurately controlled by copper reduction and laser drilling technologies; and the minimum aperture of the through hole in the substrate is controlled to be 35-25 microns when the thickness of the substrate is not greater than 29.4 microns.
Description
technical field [0001] The invention relates to a flexible circuit board, in particular to a drilling method for a flexible circuit board. Background technique [0002] FPC (Flexible Printed Circuit) is also called flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as soft board. Mainly used in mobile phones, notebook computers, PDAs, digital cameras, LCM and other products, FPC is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight and thin thickness. [0003] Currently on the market, when drilling FPCs, the process capability of the smallest through-hole diameter that can be achieved is 50 μm. But at present, for double-sided FPC, its thickness requirement is no more than 29.4 μm, and the aspect ratio (aspect ratio = plate thickness / minimum aperture) must be less than or equal to 1.2. Therefore, the mini...
Claims
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IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/107
Inventor 谢应勇李国政赖永伟
Owner 欣兴同泰科技(昆山)有限公司