Drilling method of flexible circuit board

A technology of flexible circuit board and drilling method, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., to achieve the effect of easy size

Inactive Publication Date: 2016-10-12
欣兴同泰科技(昆山)有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

But at present, for double-sided FPC, its thickness requirement is no more than 29.4 μm, and the aspect ratio (aspect ratio = plate thickness / minimum aperture) must be less than or equal to 1.2. Therefore, the minimum through hole aperture needs to be controlled at 35 μm~ 25μm, and the existing technology cannot achieve the above purpose

Method used

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  • Drilling method of flexible circuit board

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Embodiment Construction

[0020] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0021] like figure 1 As shown, the present invention provides a method for drilling a linear circuit board, and specifically includes the following steps:

[0022] First, a substrate is provided, which can be a single-layer double-sided board or a multi-layer double-sided board. Of course, the surface of the substrate is a copper layer, that is to say, the substrate referred to in the present invention is a copper-clad substrate.

[0023] Then, according to production requirements, holes are drilled on...

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Abstract

The invention discloses a drilling method for a flexible circuit board, comprising: providing a substrate; controlling the copper thickness on the surface of the substrate so that the copper thickness is not greater than 8 μm; using ultraviolet rays to perform laser drilling on the position on the substrate that must be conducted , wherein the ratio of the drilled through-hole diameter to the thickness of the substrate is less than or equal to 1.2; the residue left during drilling is removed; a layer of carbon film is formed in the area of ​​the drilled through-hole wall where the non-copper foil is located; the through-hole is copper plated. The present invention controls the thickness of the copper on the substrate to be below 8 μm, so that the subsequent drilling is easier to realize, and the size of the through hole is easier to control. The invention adopts copper reduction plus laser drilling technology, can precisely control the size of the through hole, and can control the minimum diameter of the through hole on the substrate to 35 μm to 25 μm when the thickness of the substrate is not greater than 29.4 μm.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a drilling method for a flexible circuit board. Background technique [0002] FPC (Flexible Printed Circuit) is also called flexible circuit board, flexible printed circuit board, flexible circuit board, referred to as soft board. Mainly used in mobile phones, notebook computers, PDAs, digital cameras, LCM and other products, FPC is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight and thin thickness. [0003] Currently on the market, when drilling FPCs, the process capability of the smallest through-hole diameter that can be achieved is 50 μm. But at present, for double-sided FPC, its thickness requirement is no more than 29.4 μm, and the aspect ratio (aspect ratio = plate thickness / minimum aperture) must be less than or equal to 1.2. Therefore, the mini...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0047H05K2203/107
Inventor 谢应勇李国政赖永伟
Owner 欣兴同泰科技(昆山)有限公司
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