Secondary heat pipe-based heat-dissipation structure of server cabinet

Abstract

The invention discloses a secondary heat pipe-based heat-dissipation structure of a server cabinet. The heat-dissipation structure comprises a primary heat pipe and a secondary heat pipe, wherein a plurality of servers are arranged in the server cabinet; each server comprises at least one main heating element; the primary heat pipe extends into a server case, an evaporation end is tightly attached to the main heating elements of the servers, a condensing end of the primary heat pipe is arranged outside the server case and is pressed and attached to the secondary heat pipe arranged outside the server case, so that heat generated from the inside of the servers is directly conducted by the primary heat pipe for heat exchange with the secondary heat pipe. According to the heat-dissipation structure of the server cabinet, the heat generated by the main heating elements in the server case is directly conducted through the primary heat pipe for heat exchange with the secondary heat pipe, so that the cost required for heat exchange of the server case is reduced; and heat transfer optimization of the server case is achieved.

Description

technical field [0001] The invention relates to the field of heat dissipation of a server cabinet, in particular to a heat dissipation structure of a server cabinet based on a secondary heat pipe. Background technique [0002] The data center is a typical high-energy-consuming place, which has the characteristics of high heat generation and low humidity. In recent years, the number and scale of data centers around the world have increased rapidly. Energy saving in data centers has become an important focus of current energy-saving work. At the same time, as the heat generation density of servers increases, the heat dissipation capacity of the data center cooling system is also challenged. It is foreseeable that in the near future, the demand for server-level liquid cooling technology with strong heat dissipation capacity will increase. [0003] The main method of the existing server-level liquid cooling technology is to provide chilled water from the cooling equipment and tr...

AI Technical Summary

Problems solved by technology

However, there are some problems with this method. One is that the quick connector is relatively expensive, which greatly increases the cost of the liquid cooling method. The other is that the water pipe enters the server, and there is a potential danger of water leakage.

In addition, in the existing server cabinets, the heat generated by the CPU accounts for 60% of the total cabinet heat. In the previous cabinet cooling system, the heat generated by the CPU was first discharged into the air, and then mixed with the air. The air is taken away, the working temperature of the CPU is generally 60°C, and the cooling air is generally around 20°C, the large temperature difference heat transfer causes relatively large waste

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