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Dielectric thick film ink

A dielectric, ink technology, applied in the field of thick film dielectric ink, which can solve problems such as failure, increased volume and complexity of multiple layers

Inactive Publication Date: 2016-10-26
GM GLOBAL TECH OPERATIONS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] While the DBC substrate in a power module provides the necessary level of electrical insulation and thermal conductivity, the multiple layers add bulk and complexity
Additionally, the solder joints connecting the DBC substrate to the base plate are potential failure sites due to high currents and high voltages that promote joint degradation

Method used

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  • Dielectric thick film ink
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Embodiment Construction

[0047] Various embodiments contemplated herein relate to thick film dielectric inks for electronic devices, methods of making electronic devices using the thick film dielectric inks, and electronic devices made by such methods. Exemplary embodiments herein provide thick film dielectric inks for use in electronic devices, and particularly in electronic power modules such as alternators, regulators, and inverters. Electronic power modules provide physical containment for various electronic components, typically power semiconductor devices (ie dies) that are soldered or sintered onto metal traces. Some power modules contain a single diode or power electronic switch (such as a MOSFET, IGBT, BJT, thyristor, GTO, or JFET), while others contain multiple semiconductor dies that are connected to form a circuit with a specific structure, such as with Power inverters in hybrid electric vehicles.

[0048]The thick film dielectric ink comprises an organic medium, a glass binder and a tech...

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Abstract

The invention discloses a dielectric thick film ink. A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Description

technical field [0001] The present invention relates generally to thick film inks, and more particularly to thick film dielectric inks for use in electronic power modules. Background technique [0002] Thick film inks are commonly used in the electronics industry and are of increasing importance with the trend towards smaller circuits. Thick film circuits are formed by an iterative screen printing process that typically involves depositing several successive layers of conductive and dielectric inks on a substrate. Thick film circuits are widely used in electronic devices in the automotive industry and include devices such as electronic power modules for alternators, regulators, and power inverters for hybrid vehicles. Electronic power modules generate significant amounts of heat due to high levels of current and voltage, and thus require materials with high thermal conductivity and diffusivity while still providing electrical insulation between thermally conductive componen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/03B41M1/12B41M1/28B41M1/34
CPCB41M1/12B41M1/28B41M1/34C09D11/02C09D11/03C09D11/037C09D11/14C09D11/52C09K5/10H01B3/08H01B3/12
Inventor L.M.阿尔鲍夫D.A.史密斯T.J.古斯
Owner GM GLOBAL TECH OPERATIONS LLC