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Method for manufacturing multi-stage random-layer blind holes

A production method and any layer technology, applied in multi-layer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problems of difficult control of drilling depth accuracy, high drilling depth accuracy requirements, short circuit, etc., to achieve improved Drilling efficiency, high drilling accuracy, simple manufacturing method

Inactive Publication Date: 2016-10-26
SICHUAN HAIYING ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is very difficult to control the accuracy of the drilling depth by using mechanically controlled deep drilling to make blind holes, and it is very easy for the depth of the drilled blind holes to be greater than or less than the preset depth, resulting in open or short circuits in the later process; and the circuit board The thinner the interlayer thickness between layers, the higher the precision requirement for drilling depth

Method used

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  • Method for manufacturing multi-stage random-layer blind holes
  • Method for manufacturing multi-stage random-layer blind holes
  • Method for manufacturing multi-stage random-layer blind holes

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Example one: such as figure 1 with figure 2 As shown, a manufacturing method of multi-level arbitrary layer blind holes includes the following steps:

[0019] S1. Make the first core board, take a circuit substrate a1, compound copper foil a2 on the upper surface of the circuit substrate a1, and etch away the copper foil at the location to be drilled by etching to form the first drilling position 3, to achieve The production of the first core board;

[0020] S2. Make a third core board, take a circuit substrate c4, compound copper foil c5 on the lower surface of the circuit substrate c4, and etch away the copper foil at the place to be drilled by etching to form the second drilling position 6 and the first Three drilling positions 7, to achieve the production of the third core board;

[0021] S3. Make a second core board, take a circuit substrate b8, composite copper foil I9 on the upper surface of the circuit substrate b8, composite copper foil II10 on the lower surface of ...

Embodiment 2

[0025] Embodiment two: such as image 3 with Figure 4 As shown, a manufacturing method of multi-level arbitrary layer blind holes includes the following steps:

[0026] S1. Make the first core board, take a circuit substrate a1, compound copper foil a2 on the upper surface of the circuit substrate a1, and etch away the copper foil at the location to be drilled by etching to form the first drilling position 3, to achieve The production of the first core board;

[0027] S2. Make a third core board, take a circuit substrate c4, compound copper foil c5 on the lower surface of the circuit substrate c4, and etch away the copper foil at the location to be drilled to form a second drilling position 6 to achieve The production of the third core board;

[0028] S3. Make a second core board, take a circuit substrate b8, composite copper foil I9 on the upper surface of the circuit substrate b8, composite copper foil II10 on the lower surface of the circuit substrate b8, and etch the copper fo...

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Abstract

The invention discloses a method for manufacturing multi-stage random-layer blind holes. The method comprises the following steps of S1, manufacturing a first core plate; S2, manufacturing a third core plate; S3, manufacturing a second core plate; S4, arranging a glue layer (14) between the first core plate and the second core plate, arranging a glue layer (14) between the second core plate and the third core plate, making a first drilling position (3) be superposed with a first blocking position (11), making a second drilling position (6) be superposed with a second blocking position (12), and making a third drilling position (7) be superposed with a third blocking position (13); S5, machining blind holes; and S6, performing machining on three-layer blind holes through operations of S1-S6, and repeating the steps S1-S6 so that a multilayer core plate with the blind hole are combined with the machined core plate, thereby manufacturing a multi-stage random-layer high-density circuit board with the blind holes. The method has beneficial effects of simple manufacturing method, high drilling precision, effective drilling efficiency improvement and effective production efficiency improvement.

Description

Technical field [0001] The invention relates to the technical field of blind hole processing on an HDI board, in particular to a manufacturing method of multi-level and arbitrary layer blind holes. Background technique [0002] At present, with the application of electronic products such as mobile phones, digital cameras, notebook computers, car navigation systems and IC packaging, coupled with the enhancement of electronic products and the increasing degree of miniaturization and high integration of electronic products, the The requirements of the board are constantly improving. In the current technical field of circuit board production, a multilayer circuit board usually has a plurality of conductive blind hole structures, and the multilayer circuits in the multilayer circuit board are electrically connected between adjacent layers through these conductive blind hole structures. At present, there is a deep blind hole in circuit board design. The method of making blind holes is...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/46
CPCH05K3/0047H05K3/4638H05K2203/107
Inventor 邓龙卢小燕
Owner SICHUAN HAIYING ELECTRONICS TECH