SMT proofing machine
A proofing machine and patch technology, which is applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems that cannot meet the needs of production, and achieve the effects of improving efficiency, uniform heating, and avoiding insufficient bonding
Inactive Publication Date: 2016-10-26
成都俱进科技有限公司
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Problems solved by technology
The circuit board needs to place and bond the original components on the circuit board before reflow soldering. The number and types of components on the circuit board are very large. The previous mechanical placement process can no longer meet the production needs.
Method used
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Embodiment 1
[0020] Such as figure 1 As shown, this embodiment includes a housing 2, and an inlet and an outlet are respectively opened on both sides of the housing 2, and the conveying mesh belt 4 extends outwards after passing through the inlet and the outlet in turn, and the inside of the housing 2 is conveyed The belt 4 is divided into two identical cavities, and the cavity includes a heating zone near the entrance and a cooling zone 6 close to the exit. In the heating zone, a plurality of heating mechanisms 3 are arranged side by side, and the heating mechanisms 3 It includes a cylinder body 31 with one end open and a plurality of heating tubes 33, an opening is provided on the side wall of the cylinder body 31, a terminal plate 32 is embedded in the opening, and a plurality of the heating tubes 33 are connected in parallel through the terminal plate 32 After being connected with an external power supply together, the air intake pipe 1 extends through the outer wall of the housing 2 a...
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The invention discloses an SMT proofing machine, and the proofing machine comprises a housing. The interior of the housing is divided by a conveying belt into two identical cavities. Each cavity comprises a heating region and a cooling region, wherein the heating region is provided with a plurality of heating mechanisms in a parallel manner. Each heating mechanism comprises a cylinder with an opened end, and a plurality of heating pipes. The plurality of heating pipes are connected in parallel through a wiring terminal board, and then are connected with an external power supply. An air incoming pipe passes through the external wall of a housing, and then extends in the heating region. An extending segment of the air incoming pipe is communicated with closed ends of a plurality of cylinders. The opened ends of the cylinders are provided with splitter plates, and the splitter plates are provided with a plurality of ejection holes. The interior of each cooling region is provided with an air outgoing pipe, and the air outgoing pipes pass through the external wall of the housing, and extend outwards. In use, the proofing machine enables two sides of a circuit board in the housing to be heated uniformly because the two cavities are symmetrically distributed through taking a transport network belt as the symmetry center, so as to achieve the uniform heating of solder paste on the circuit board, and to improve the surface assembly efficiency of the circuit board.
Description
technical field [0001] The invention relates to an SMT production line, in particular to an SMT patch proofing machine. Background technique [0002] The general SMT production process includes three steps of solder paste printing, placement and reflow soldering, so to form a complete SMT production line, it must include equipment to implement the above process steps: printing machine, placement machine and reflow soldering oven. There is a heating circuit inside the reflow soldering equipment, which heats the air or nitrogen to a high enough temperature and blows it to the circuit board on which the components have been pasted, so that the solder on both sides of the components melts and bonds with the main board. The circuit board needs to place and bond the original components on the circuit board before reflow soldering. The number and types of components on the circuit board are very large, and the previous mechanical placement process can no longer meet the production ...
Claims
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IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/043
Inventor 杨键
Owner 成都俱进科技有限公司