Wire arrangement tooling for wire welding

Abstract

The invention discloses a wire arrangement tool and process for wire welding. The tool comprises a base plate, high-temperature adhesive tape, paper tape and alignment tools. The base plate is of a long-strip-shaped structure. Multiple parallel wire grooves are formed in the width direction of the base plate. Each wire groove is required to be deep enough to allow two wires to be placed therein. The alignment tools are arranged at the two ends of the base plate. The aligned wires are bonded through the high-temperature adhesive tape. The wires bonded to the high-temperature adhesive tape are transferred to the paper tape and wait for welding. The wire arrangement process for wire welding to which the tool is applied comprises a wire groove process in which the wires are inserted into the base plate, a wire alignment process, a wire transferring process and a chip head insertion process at a minimum. The wire arrangement tool and process for wire welding are easy to operate; the requirement for post skills of workers is not high; the efficiency is two times or above that of the process that one-by-one welding is conducted through traditional manual work; cost is lowered; the delivery time is shortened; quality is improved; and a foundation is laid for procedures occurring after wire arrangement, such as total frame welding, encapsulation and semi-automatic measurement.

Description

technical field [0001] The invention relates to the technical field of chip and wire welding technology, in particular to a wire arrangement tool for wire welding and a wire arrangement process. Background technique [0002] The existing welding process of chips and wires is relatively complicated, and it is difficult for employees to master it. New employees need to be trained for 4-6 months to meet the quality requirements of the new welding process, but the efficiency can only reach half of that of old employees. In addition, when the head of the chip is soldered upwards, the head and tail of the chip are particularly prone to tin sticking, because it is difficult to check the tin sticking phenomenon after the tail of the wire is soldered by two leather wires, and the quality risk is great. Contents of the invention [0003] In order to overcome the above-mentioned deficiencies in the prior art, the present invention provides a wire arrangement tool and a wire arrangeme...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above-mentioned deficiencies in the prior art, the present invention provides a wire arrangement tool and a wire arrangement process for wire welding, the purpose of which is to shorten the preparation time before welding the chip and the wire, and at the same time ensure that the soldering of the chip and the wire is not easy to produce tin sticking phenomenon, And ensure that it has better quality when welding

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