Resistance paste with high electrothermal conversion rate

Abstract

The invention discloses resistance paste with high electrothermal conversion rate. The resistance paste comprises the following components in percentage by weight: 20%-40% of an organic phase, 50%-70% of a conductive phase, 8%-18% of glass powder and 0.3%-1.0% of aluminum nitride powder, wherein the organic phase is a mixture of multiple dibasic acid esters; the conductive phase is prepared from one or two of nano/micron flake silver powder and nano/micron spherical silver powder; the glass powder is lead-free glass powder; and the aluminum nitride powder is spherical or fibrous nano powder. The electrothermal conversion rate of the resistance paste disclosed by the invention can reach 95%; the stability is good; the high temperature resistance is excellent; and the resistance paste is good in adhesive force with a base material and does not easily fall off.

Description

Technical field: [0001] The invention relates to the technical field of heating devices, in particular to a resistance paste with high electrothermal conversion rate. Background technique: [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production adopts process and standardization to reduce costs. Printed circuit boards are born to meet the needs of the microelectronics industry. In the sustainable development strategy established by our country, the heating elements of electronic components are required to be small in size and high in power. To make more power on the substrate of the same area, it is often necessary to increase the area of ​​the paste pattern, which will inevitably cause The temperature of the heat generating device itself rises. The invention selects nano-aluminum nitride as the thermally conductive functional phase, which can reduce the heat accumulation of the slurry itself...

AI Technical Summary

Problems solved by technology

In the sustainable development strategy established by our country, the heating elements of electronic components are required to be small in size and high in power. To make more power on the substrate of the same area, it is often necessary to increase the area of ​​the paste pattern, which will inevitably cause The temperature of the heat-generating device itself rises

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