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Plasma Resistant Thin Film Coatings for High Temperature Applications

A plasma-resistant and plasma-resistant technology, which is applied in the direction of coating, ion implantation plating, metal material coating process, etc., can solve the problems such as unsuitable chamber parts

Active Publication Date: 2020-03-03
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Conventional plasma sprayed protective coatings may not be suitable for some chamber components used in this type of process

Method used

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  • Plasma Resistant Thin Film Coatings for High Temperature Applications
  • Plasma Resistant Thin Film Coatings for High Temperature Applications
  • Plasma Resistant Thin Film Coatings for High Temperature Applications

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Embodiment Construction

[0016] Embodiments of the invention provide articles, such as chamber components for atomic layer deposition (ALD) chambers, having a thin film protective layer on one or more surfaces of the article. The protective layer can have a thickness of less than about 50 microns and can provide plasma erosion resistance to protect the article. During wafer processing, chamber components may be exposed to high temperatures. For example, chamber components may be exposed to temperatures in excess of 450°C. The thin film protective layer is formed in a manner that can resist cracking or is effectively immune to cracking at these high temperatures. The thin film protective layer can be a dense conformal thin film deposited on a heated substrate using ion assisted deposition (IAD). The film protection layer can be made of Y 3 Al 5 o 12 、Er 3 Al 5 o 12 or YF 3 form. The improved corrosion resistance provided by the thin film protective layer can improve the useful life of the art...

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Abstract

An article, such as a susceptor, includes a body of thermally conductive material coated by a first protective layer and a second protective layer over a surface of the body. The first protective layer is thermally conductive ceramic. The second protective layer covers the first protective layer and is a plasma-resistant ceramic film that resists cracking at a temperature of 650°C.

Description

technical field [0001] In general, embodiments of the invention generally relate to protective chamber components that are frequently exposed to high temperatures and direct or remote plasma environments. Background technique [0002] In the semiconductor industry, devices are fabricated through a number of fabrication processes that produce structures of ever decreasing size. Some fabrication processes, such as plasma etching and plasma cleaning processes, expose substrates to high velocity plasma streams to etch or clean the substrates. Plasmas can be highly aggressive and can attack processing chambers and other surfaces exposed to the plasma. Accordingly, plasma sprayed protective coatings are commonly used to protect processing chamber components from corrosion. [0003] Some manufacturing processes are performed at high temperatures (eg, temperatures in excess of 400°C). Conventional plasma sprayed protective coatings may not be suitable for some chamber components ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/3065H01L21/56H01L21/324
CPCC23C14/024C23C14/08C23C14/083C23C16/4581C23C16/50C23C14/0635C23C14/221C23C14/0694C23C16/45536H01J37/32477C23C14/081
Inventor V·菲鲁兹多尔B·P·卡农戈J·Y·孙M·J·萨里纳斯J·A·李
Owner APPLIED MATERIALS INC