Method for manufacturing high-effect low-cost LED lamp heat radiation protection mechanism

Abstract

The invention discloses a manufacturing method of a high-efficiency and low-cost LED lamp heat dissipation protection mechanism. In order to overcome the shortcomings of the existing LED lamp heat dissipation protection mechanism, such as high manufacturing cost, high material waste, unsatisfactory heat dissipation effect, easy burnout of the LED lamp assembly, and affecting the service life of the LED lamp, the heat transfer material layer of the present invention is bent at intervals between the front and back, and the two sides The ends are connected or coiled and fixed from one end to the other to form a heat sink with bends, heat transfer walls or / and flat walls, and heat dissipation intervals. The present invention is used to manufacture LED lamps. The test results show that it can save more than 30% of manufacturing materials, reduce manufacturing costs by more than 27%, and can greatly reduce the initial purchase cost of LED lamps. In particular, it has good heat transfer and heat dissipation effects and can more effectively protect The LED lamp realizes energy saving, high efficiency and long life, and the service life is more than doubled, and the volume of the LED lamp is reduced by one-third, and the appearance of the LED lamp is more abundant and perfect.

Description

technical field [0001] The invention relates to a manufacturing method of an LED lamp component, in particular to a manufacturing method of a high-efficiency and low-cost LED lamp heat dissipation protection mechanism. Background technique [0002] Existing LED lamps will generate a lot of heat when they are working. If the heat dissipation is not smooth, it is easy to burn out the LED chips, LED lamp drive power components, etc., thereby shortening the service life of the LED lamp and increasing the use cost of the LED lamp. [0003] The heat dissipation of the existing LED lamp is completed by the heat dissipation mechanism, and the heat produced by the LED chip is conducted to the heat dissipation mechanism through the LED substrate, so the heat transfer and heat dissipation efficiency is not ideal. [0004] The manufacturing method of the heat dissipation mechanism of the existing LED lamp is to turn or cast a whole piece of aluminum material, which has an inner cavity w...

AI Technical Summary

Problems solved by technology

[0002] Existing LED lamps will generate a lot of heat when they are working. If the heat dissipation is not smooth, it is easy to burn out the LED chips, LED lamp drive power components, etc., thereby shortening the service life of the LED lamp and increasing the use cost of the LED lamp.

[0003] The heat dissipation of existing LED lamps is completed by the heat dissipation mechanism, and the heat generated by the LED chip must be conducted to the heat dissipation mechanism through the LED substrate, so the heat transfer and heat dissipation efficiency is not ideal

[0004] The manufacturing method of the heat dissipation mechanism of the existing LED lamp is to turn or cast a whole piece of aluminum material, which has an inner cavity with a closed and impenetrable peripheral wall. There is no heat transfer and heat dissipation opening directly leading to the inner cavity between adjacent heat sinks (that is, the inner cavity wall is closed). The initial purchase cost increases, especially the heat transfer and heat dissipation is not smooth, the heat dissipation efficiency is low, the effect is not ideal, and it is easy to generate high accumulated temperature, which often burns out the LED chip and LED lamp drive power due to the high heat accumulation of the LED lamp, thus shortening the LED lamp. The service life of LED lights is increased, and the advantages of LED lights are greatly reduced.

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