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Electronic Packaging Member And Method For Manufacturing Same

A technology for electronic packaging and electronic components, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of limited heat dissipation effect, failure to meet heat dissipation requirements, poor thermal conductivity, etc., and achieve the purpose of improving the heat dissipation effect Effect

Active Publication Date: 2016-11-23
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the existing manufacturing method of the semiconductor package 1, the encapsulant 13 is a material with poor thermal conductivity, and its heat transfer coefficient (Heat Transfer Coefficient) is only 0.8w / mK, so the semiconductor chip 11 produces The heat dissipation path of the heat needs to go through the encapsulation compound 13 to the heat sink 12, resulting in limited heat dissipation effect, and even unable to meet the heat dissipation requirements.

Method used

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  • Electronic Packaging Member And Method For Manufacturing Same
  • Electronic Packaging Member And Method For Manufacturing Same
  • Electronic Packaging Member And Method For Manufacturing Same

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Embodiment Construction

[0049] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0050] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those skilled in the art, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and "a"...

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Abstract

The present invention relates to an electronic packaging member and a method for manufacturing the same. The electronic packaging member comprises a radiating member, an electronic element combined with the radiating member, so that a radiating path of the heat generated by the electronic element is directly communicated with the radiating member, and accordingly, a heat radiation effect is improved effectively.

Description

technical field [0001] The invention relates to an electronic package, in particular to an electronic package with a heat dissipation structure and a manufacturing method thereof. Background technique [0002] Electronic products are becoming thinner, smaller, and denser. With the advancement of semiconductor manufacturing technology, more and more electronic components are integrated into the chip. However, the heat generated by these electronic components during operation is often due to the poor thermal conductivity of the encapsulant, which leads to the inability to effectively discharge the heat energy, thereby reducing the life of the electronic components. Therefore, the heat dissipation of the chip becomes an important design factor of the package. Therefore, in order to quickly discharge the heat generated by the chip to the environment, a heat sink is usually placed above the chip so that the heat generated by the chip can be transferred to the external environment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/34H01L23/498H01L21/50H01L21/48
CPCH01L2224/04105H01L2224/12105H01L2224/32245H01L2224/48091H01L2224/73267H01L2924/181H01L2924/00012H01L2924/00014
Inventor 邱士超陈嘉成林俊贤白裕呈范植文
Owner SILICONWARE PRECISION IND CO LTD