LED packaging element
A technology for light-emitting diodes and packaging components, applied in electrical components, semiconductor devices, circuits, etc., can solve the problems of adjusting color temperature, high color temperature, inconvenience, etc., and achieve the effect of extending service life and good heat dissipation
Active Publication Date: 2016-11-23
YANGZHOU EDISON OPTO
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Problems solved by technology
[0003] However, the color or color temperature of traditional light-emitting devices with white light-emitting diodes is fixed, resulting in a high color temperature. It is impossible to adjust the expected color temperature according to the lighting environment or application range, and it is also impossible to achieve uniform light mixing.
Therefore, if the light-emitting device is required to produce the expected color temperature of the light, it is necessary to replace the light-emitting device with the expected color temperature, resulting in additional design costs and procurement costs.
[0004] This shows that there are still inconveniences and defects in the above-mentioned method, and it needs to be further improved.
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[0029] A number of embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings.
[0030] figure 1 A top view showing a light emitting diode packaging component 10 according to an embodiment of the present invention, figure 2 draw figure 1 2-2 partial cutaway view. Such as figure 1 and figure 2 As shown, in this embodiment, the light emitting diode packaging component 10 includes a substrate 100 , a plurality of light emitting chips 210 , 220 , a plurality of first wave...
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A light-emitting diode packaging component includes a substrate, a plurality of light-emitting crystal grains and a wavelength conversion sealant. These light-emitting crystal grains are arranged on the substrate. A part of the light-emitting crystal grains are respectively covered with a wavelength conversion patch. The wavelength conversion patch is used for converting light with a first color temperature. The wavelength conversion encapsulant covers the substrate, the luminous crystal grain and the wavelength conversion patch for converting light with a second color temperature, which is different from the first color temperature. In this way, the light emitting diode packaging element of the present invention simultaneously generates light with different color temperatures, and mixes the light to generate the desired light color temperature, so as to solve the problems of high color temperature and uneven light mixing of traditional light emitting diodes.
Description
technical field [0001] The invention relates to a light-emitting diode packaging component, especially a light-emitting diode packaging component that can adjust a desired color temperature. Background technique [0002] Because the traditional white light emitting diode has the advantages of power saving, low driving voltage, long life and environmental protection effect, it is gradually used in various lighting equipment and the backlight of liquid crystal display, and has become one of the important light emitting devices at present. High color rendering index (CRI) white light has always been the goal pursued by semiconductor light emitting sources. [0003] However, the color or color temperature of light emitted by traditional light emitting devices with white light emitting diodes is fixed, resulting in a high color temperature. It is impossible to adjust the expected color temperature according to the lighting environment or application range, and it is also impossib...
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IPC IPC(8): H01L33/50H01L33/56
Inventor 曾国峰
Owner YANGZHOU EDISON OPTO