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Flexible substrate MEMS device curved array photoacoustic imaging system

A photoacoustic imaging and flexible substrate technology, applied in the fields of sensors, medical science, diagnosis, etc., can solve the problems of large structure, time-consuming and complicated photoacoustic imaging devices, and achieve the goal of simplifying the structure, speeding up the imaging speed and reducing the volume Effect

Active Publication Date: 2016-12-07
凌斌 +2
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  • Application Information

AI Technical Summary

Problems solved by technology

This kind of photoacoustic imaging device has a large and complex structure, and the process of realizing large-area imaging takes a long time, and it is not suitable for curved surface imaging

Method used

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  • Flexible substrate MEMS device curved array photoacoustic imaging system
  • Flexible substrate MEMS device curved array photoacoustic imaging system
  • Flexible substrate MEMS device curved array photoacoustic imaging system

Examples

Experimental program
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Embodiment Construction

[0026] see figure 1 In this embodiment, the photoacoustic imaging system for the curved surface array of the flexible substrate MEMS device includes a light source module, a photoacoustic module, a signal acquisition module, an image module and a control module.

[0027] Such as figure 2 , image 3 , Figure 4 and Figure 7 As shown, the photoacoustic module 16 has a layer structure, and the layer structure is stacked sequentially from bottom to top to be MEMS micromirror array and fiber channel layer 4, flexible printed circuit board interconnection layer 3, MEMS acoustic transducer array layer 2 and acoustic impedance matching Layer 1; wherein, the MEMS acoustic transducer array layer 2 is fixed on the upper surface of the flexible printed circuit board interconnection layer 3 by welding; the main body of the MEMS micromirror array and the fiber channel layer 4 is a flexible polymer structure. Channels and grooves are made on the flexible polymer structure, and MEMS mic...

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Abstract

The invention discloses a flexible substrate MEMS device curved array photoacoustic imaging system. The system is characterized in that a photoacoustic module arranged in the system is sequentially overlapped into an MEMS micromirror array and optical fiber channel layer, a flexible printed circuit board interconnection layer, an MEMS acoustic transducer array layer and an acoustic impedance matching layer from bottom to top to form a flexible photoacoustic module which is provided with a flexible body and can be pasted on a curved surface; the photoacoustic module is formed by arraying various imaging units, an independent micro-region photoacoustic imaging system is established by each imaging unit, two-dimensional scanning of lasers in micro-regions corresponding to the imaging units is achieved, and three-dimensional imaging in the micro-regions is completed; a complete full-region image is obtained through image splicing. The system is suitable for rapid large-area high-performance imaging of the inner surfaces of natural orifices of the human body and the outer body surface of the human body.

Description

technical field [0001] The invention relates to a photoacoustic imaging system, in particular to a photoacoustic imaging system with a flexible substrate MEMS device curved surface array. Background technique [0002] In photoacoustic imaging for disease diagnosis, imaging coverage, imaging speed, and spatial resolution are all very important. The large imaging coverage area helps to observe the overall situation of the imaging tissue, and the high spatial resolution can distinguish finer biological tissues and functional changes, thereby realizing early diagnosis of diseases. The high imaging speed enables photoacoustic imaging to reduce artifacts caused by body movements, such as breathing, pulsation, and organ peristalsis, reduce costs and patient discomfort duration, achieve high-throughput imaging before procedures, and reduce invasive treatments at the same time , such as the risks posed by endoscopy. Currently, photoacoustic imaging systems are usually composed of a...

Claims

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Application Information

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IPC IPC(8): A61B5/00
CPCA61B5/0095
Inventor 凌斌吴校生冯定庆
Owner 凌斌
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