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Thick film circuit rare-earth electrode slurry based on stainless steel base material and preparation method thereof

A rare earth electrode paste, thick film circuit technology, applied in conductive materials, circuits, cables/conductors dispersed in non-conductive inorganic materials, etc., can solve problems such as high cost, unfavorable environmental protection, etc., and achieve low equipment requirements , good weldability, the effect of changing the sintering properties

Inactive Publication Date: 2016-12-07
DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional burn-in type electrode paste contains a large amount of lead, which is not conducive to environmental protection. The conductive adhesive currently used often contains some harmful substances, and the cost is relatively high.

Method used

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  • Thick film circuit rare-earth electrode slurry based on stainless steel base material and preparation method thereof
  • Thick film circuit rare-earth electrode slurry based on stainless steel base material and preparation method thereof
  • Thick film circuit rare-earth electrode slurry based on stainless steel base material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A thick-film circuit rare-earth electrode slurry based on a stainless steel substrate, in terms of mass percentage, consists of the following components:

[0043] Composite functional phase 65%,

[0044] Inorganic binder phase 5%,

[0045] organic vehicle 30%,

[0046] The stainless steel substrate is a stainless steel plate;

[0047] The composite functional phase is composed of the following components in terms of mass percentage:

[0048] Nano spherical silver powder 90%,

[0049] Palladium powder 5%,

[0050] CeO 2 5%;

[0051] The inorganic bonding phase is lead-free glass-ceramic powder, and is composed of the following components in terms of mass percentage:

[0052] SiO 2 25%, CaO 20%,

[0053] B 2 o 3 30%, Al 2 o 3 10%,

[0054] Bi 2 o 3 10%, TiO 2 5.0%;

[0055] Described organic carrier, by mass percentage, comprises following components:

[0056]

[0057] Its preparation method comprises the following steps:

[0058] (1) Preparatio...

Embodiment 2

[0067] A thick-film circuit rare-earth electrode slurry based on a stainless steel substrate, in terms of mass percentage, consists of the following components:

[0068] Composite functional phase 70%,

[0069] Inorganic binder phase 5%,

[0070] Organic vehicle 25%;

[0071] The stainless steel substrate is a stainless steel tube;

[0072] The composite functional phase is composed of the following components in terms of mass percentage:

[0073] Nano spherical silver powder 85%,

[0074] Palladium Powder 10%,

[0075] SM 2 o 3 5%;

[0076] The inorganic bonding phase is lead-free glass-ceramic powder, and is composed of the following components in terms of mass percentage:

[0077] SiO 2 40%, CaO 15%,

[0078] B 2 o 3 25%, Al 2 o 3 7.5%,

[0079] Bi 2 o 3 7.5%, ZrO 2 5.0%;

[0080] Described organic carrier, by mass percentage, comprises following components:

[0081]

[0082] Its preparation method comprises the following steps:

[0083] (1) Pr...

Embodiment 3

[0092] A thick-film circuit rare-earth electrode slurry based on a stainless steel substrate, in terms of mass percentage, consists of the following components:

[0093] Composite functional phase 79%,

[0094] Inorganic binder phase 1%,

[0095] organic vehicle 20%,

[0096] The base material is a stainless steel plate;

[0097] The composite functional phase is composed of the following components in terms of mass percentage:

[0098] Nano spherical silver powder 80%,

[0099] Palladium Powder 10%,

[0100] Gd 2 o 3 10%;

[0101] The inorganic bonding phase is lead-free glass-ceramic powder, and is composed of the following components in terms of mass percentage:

[0102] SiO 2 35%, CaO 20%,

[0103] B 2 o 3 25%, Al 2 o 3 7.5%,

[0104] Bi 2 o 3 7.5%, MoO 3 5%;

[0105] Described organic carrier, by mass percentage, comprises following components:

[0106]

[0107] Its preparation method comprises the following steps:

[0108] (1) Preparation of...

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Abstract

The invention discloses a thick film circuit rare-earth electrode slurry based on a stainless steel base material. The thick film circuit rare-earth electrode slurry comprises a compound function phase, an inorganic binding phase and an organic carrier, wherein the compound function phase consists of nano silver powder, palladium powder and a rare earth oxide; the inorganic binding phase consists of SiO2, CaO, B2O3, Al2O3, Bi2O3 and a nucleation agent; and the organic carrier consists of an organic solvent, macromolecule resin, a dispersing agent, a defoaming agent and a thixotropic agent. A preparation method of the thick film circuit rare-earth electrode slurry comprises the following steps: preparing the compound function phase; preparing the inorganic binding phase; preparing the organic carrier; and preparing the electrode slurry. The thick film circuit rare-earth electrode slurry prepared by the invention is good in electrical conductivity, high in adhesive force, high in weldability, high in welding dissolution resistance, good in printing and sintering characteristics and high in environmental protection capability, is matched with the stainless steel base material, and is good in wettability and compatibility with dielectric slurries and resistance slurries.

Description

Technical field: [0001] The invention relates to the field of electronic materials, in particular to a thick film circuit rare earth electrode slurry based on a stainless steel substrate. Background technique: [0002] In the field of electric heating, new heating elements require small volume, high power, small thermal inertia, large surface heat load, low power consumption, high thermal efficiency, fast thermal start, stable power, uniform temperature field, and process Good performance, automatic temperature control of the body, safe and reliable operation, long life and wide application range. Electrode paste is the key material for packaging, electrodes and interconnection of electronic components, and mainly includes two categories: burn-in type electrode paste and curable conductive adhesive. Electrode paste can be divided into carbon paste (graphite conductor), metal paste (gold powder, silver powder, copper powder, silver-copper alloy) and modified ceramic paste ac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00
CPCH01B1/22H01B13/00
Inventor 高丽萍苏冠贤
Owner DONGGUAN COREHELM ELECTRONICS MATERIAL TECH CO LTD
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