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Manufacturing device and manufacturing method

A technology for manufacturing devices and light-receiving devices, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device testing/measurement, electrical components, etc., and can solve problems such as deterioration of cutting quality, damage to the tip of the rotary knife, and production of defective products. Achieve the effect of suppressing manufacturing cost and simplifying the structure

Active Publication Date: 2019-09-13
TOWA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] If the cutting of the sealed substrate is continued, the cutting edge of the rotary knife may be damaged (missing, cracked) due to clogging or filling of abrasive grains of the rotary knife, cutting load, etc.
If damage occurs, normal cutting cannot be performed, resulting in deterioration of cutting quality
In the case of damage, if the rotary knife is not replaced, defective products may be produced

Method used

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  • Manufacturing device and manufacturing method
  • Manufacturing device and manufacturing method
  • Manufacturing device and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0085] refer to Figure 1a to Figure 4b , a cutting mechanism for cutting a sealed substrate as an example of the manufacturing apparatus of the present invention will be described. Any of the drawings in the present application are appropriately omitted or exaggerated and schematically depicted for easy understanding. The same symbols are assigned to the same constituent elements, and explanations thereof are appropriately omitted.

[0086] Such as Figure 1a-1c As shown, the cutting mechanism 1 included in the manufacturing apparatus includes a fixing plate 2 . The cutting mechanism 1 is moved in the X direction by moving the fixed plate 2 in the X direction along the X axis using guide rails (not shown). The fixed plate 2 is provided with a Z-axis guide rail 3 and a Z-axis drive mechanism 4 . For example, a servo motor, a stepping motor, or the like is fixed to the fixing plate 2 as the drive mechanism 4 . The driving mechanism 4 lifts and lowers the lifting member 6 t...

Embodiment 2

[0139] refer to Figure 6 The manufacturing apparatus of this example is demonstrated. Such as Figure 6 As shown, the manufacturing device 34 is a device that singulates a cut object to form a plurality of products. The manufacturing apparatus 34 includes a substrate supply unit A, a substrate cutting unit B, and an inspection unit C as constituent elements, respectively. Each component (units A to C) is detachable and replaceable with respect to other components.

[0140] The substrate supply unit A is provided with a substrate supply mechanism 35 . The sealed substrate 11 corresponding to the object to be cut is carried out from the substrate supply mechanism 35 and transferred to the substrate cutting unit B by a transfer mechanism (not shown). The board|substrate supply unit A is provided with the control part 32 which performs operation or control of the manufacturing apparatus 34, the cutting mechanism 1, the rotary knife detection mechanism 12, and the sensor mechani...

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PUM

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Abstract

The present invention is to detect both breakage and wear of a rotating blade by using one sensor mechanism and one driving mechanism lifting a cutting mechanism. A cutting mechanism (1) is provided with a rotating blade detection mechanism (12) including a sensor mechanism (13), a rotation member (14), a rotation shaft (15), and a pressing member (17), a Z-axis driving mechanism (4) substantially lifts the sensor mechanism (13), the position of the sensor mechanism (13) in a state where the lower end of the rotating blade (10) is positioned at a predetermined cutting position, or the position of the sensor mechanism (13) in a state where an optical axis (AX) of the sensor mechanism (13) is positioned at a predetermined standby position is selected. Breakage of the rotating blade (10) is detected in a state where the lower end of the rotating blade (10) is positioned at a predetermined cutting position when a sealing-completed substrate (11) is cut, and wear of the rotating blade (10) is detected in a state where the optical axis (AX) is positioned at a predetermined standby position when the sealing-completed substrate (11) is not cut. Wear and breakage of the rotating blade (10) are detected by using the sensor mechanism (13) and the Z-axis driving mechanism (4).

Description

technical field [0001] The present invention relates to a manufacturing device and a manufacturing method for cutting and singulating a cut object to form a plurality of products. Background technique [0002] A printed circuit board or a substrate composed of a lead frame is virtually divided into a plurality of grid-shaped areas, and chip-shaped components (such as semiconductor chips) are mounted on each area, and the entire substrate is resin-sealed to obtain the so-called Sealed substrate. The sealed substrate is cut using a cutting mechanism such as a rotary knife, and separated into individual pieces in units of regions to form a product. [0003] It is known that a predetermined region of a sealed substrate is cut by a cutting device such as a rotary knife using a cutting mechanism in a manufacturing apparatus. First, an object to be cut (that is, a sealed substrate) is placed and adsorbed on a stage for cutting. Next, the sealed substrates are aligned (positional...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/78
CPCH01L21/67092H01L21/78B26D1/0006B26D1/14H01L21/67005H01L22/30
Inventor 片冈昌一望月启人
Owner TOWA