Camera

Abstract

The invention relates to the technical field of camera equipment and discloses a camera. The camera comprises a shell, wherein the shell comprises a front shell and a back shell which are not in touch with each other; a thermal insulation device for stopping the front shell and the back shell from carrying out heat transfer is arranged between the front shell and the back shell; at least one first heating part is arranged in the front shell; at least one second heating part is arranged in the back shell; the first heating part is connected to the front shell through a first heat dissipation part; and the second heating part is connected to the back shell through a second heat dissipation part. In the embodiments, owing to isolation of the thermal insulation device, the influence of the heat radiation or heat convection by the second heating part on the first heating part in the back shell is shielded, and the heat dissipation of the front shell cannot be affected by the high temperature of the back shell, so that the heat dissipation effect of the whole camera can be remarkably improved.

Description

technical field [0001] The present invention relates to the technical field of camera equipment, in particular to a camera. Background technique [0002] As the functions of security monitoring cameras increase, their power consumption density is also increasing, and heat dissipation has become a major difficulty for cameras. The key device of the camera, the image sensor (sensor) type is generally CCD or CMOS, which are heat-sensitive devices, and the temperature directly affects its reliability and life. [0003] In order to reduce the temperature of the image sensor (sensor), the existing security surveillance camera solutions can be roughly divided into the following two types: [0004] A metal heat sink (aluminum or copper) is added between the CCD and the PCB, and the metal plate is attached to the shell to dissipate heat; when this heat dissipation method is adopted, the heat source of the camera generally includes power consumption devices on the PCB such as the CCD...

AI Technical Summary

Problems solved by technology

[0005] Another way is to use a heat conduction film to connect the CMOS to the metal block to dissipate heat. However, when using this heat dissipation method, the heat of the CMOS is transferred to the metal block through the heat conduction film, and the heat needs to pass through other components inside the camera and the camera housing. The radiative heat transfer is then transferred to the environment, and the thermal resistance on the heat transfer path is relatively large. In fact, this solution has a small improvement in heat dissipation for CMOS. At the same time, it is also affected by the heat transfer of other power consumption devices in solution 1.

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