Printed circuit board and mobile terminal

Abstract

The invention discloses a printed circuit board and a mobile terminal. The printed circuit board comprises a board body having a first region for main welding plate arrangement, a main welding plate arranged at the first region, solder separation bars, soldering tin layers, and an electronic device. The solder separation bars arranged at the first region divide the main welding plate into a plurality of sub welding plates and are used for preventing the series flowing of soldering tin among the adjacent sub welding plates during the welding process. The soldering tin layers are arranged on the sub welding plates. The electronic device arranged at the first region is connected with the sub welding plates by the soldering tin layer. According to the provided printed circuit board, because the main welding plate are divided into multiple sub welding plates by the solder separation bars and the dimensions of the sub welding plates are smaller than that of the main welding plate, the soldering tin can be arranged on all sub welding plates during the welding process and welding bubbles and holes in the soldering tin layers are prevented, thereby guaranteeing stability and the heat radiation performance of the QFN packaging device welding.

Description

technical field [0001] The invention relates to communication technology, in particular to a printed circuit board and a mobile terminal. Background technique [0002] Existing mobile phone PCBs (ie: printed circuit boards) have devices with large pads (ie: electronic devices, such as QFN packaged devices), and due to performance such as heat dissipation, it is necessary to design a large ground pad (equivalent to the "main soldering pad" in this application). disc"), and the existing traditional soldering, the large ground pad (size 3mm*3mm) is directly soldered to the QFN packaged device, because the size of the large ground pad is large, the fluidity of the solder is poor during the high-temperature melting process of the reflow furnace, As a result, the solder cannot be extended on the surface of the large grounding pad, so that there will be no solder in some places on the large grounding pad, that is, welding bubbles and voids will be formed (can be detected by X-RAY d...

AI Technical Summary

Problems solved by technology

[0002] Existing mobile phone PCBs (ie: printed circuit boards) have devices with large pads (ie: electronic devices, such as QFN packaged devices), and due to performance such as heat dissipation, it is necessary to design a large ground pad (equivalent to the "main soldering pad" in this application). disc"), and the existing traditional soldering, the large ground pad (size 3mm*3mm) is directly soldered to the QFN packaged device, because the size of the large ground pad is large, the fluidity of the solder is poor during the high-temperature melting process of the reflow furnace, As a result, the solder cannot be extended on the surface of the large grounding pad, so that there will be no solder in some places on the large grounding pad, that is, welding bubbles and voids will be formed (can be detected by X-RAY detector), affecting QFN Soldering stability and heat dissipation of packaged devices

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