Glue dispensing method and device

A technology of dispensing and location information, applied in the field of communication, can solve problems such as deviation, achieve the effect of eliminating deviation, improving dispensing effect, and improving accuracy

Inactive Publication Date: 2016-12-21
VIVO MOBILE COMM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Embodiments of the present invention provide a dispensing method and device to solve the problem of de

Method used

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  • Glue dispensing method and device
  • Glue dispensing method and device

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Experimental program
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Example

[0021] First embodiment

[0022] See figure 1 , figure 1 Is the flow chart of the glue dispensing method provided by the embodiment of the present invention, such as figure 1 As shown, including the following steps:

[0023] Step 101: Collect position information of electronic components on the circuit board.

[0024] In this step, the position information of the electronic components soldered on the circuit board is collected, where the position information is collected by the image sensor set on the dispenser. Image sensors can be divided into CCD (Charge Coupled Device) and CMOS (Complementary Metal-Oxide Semiconductor) according to different components. Since the CCD image sensor has the characteristics of high resolution, low noise, wide dynamic range, small size and light weight, the image sensor in this embodiment is preferably a CCD image sensor.

[0025] Step 102: Use the position information and preset outline size information of the electronic component to generate a glue ...

Example

[0031] Second embodiment

[0032] See figure 2 , figure 2 Is the flow chart of the glue dispensing method provided by the embodiment of the present invention, such as figure 2 As shown, including the following steps:

[0033] Step 201: Collect the coordinates of the center position of the electronic component on the circuit board.

[0034] In this step, the image information of the electronic components on the circuit board is collected by the CCD image sensor, and the preset basic size parameters of the electronic components and the basic size parameters of the circuit board are used to combine the image information of the electronic components on the circuit board. The information can get the coordinates of the center position of the electronic component on the circuit board.

[0035] Step 202: Collect the placement direction of the electronic component on the circuit board.

[0036] In this step, by collecting the contour information of the electronic components and the contour i...

Example

[0051] The third embodiment

[0052] See Figure 4 , Figure 4 It is the structure diagram of the glue dispensing device provided by the implementation of the present invention, such as Figure 4 As shown, the glue dispensing device 400 includes a collection module 401, a generation module 402, and a dispensing module 403, wherein the collection module 401 is connected to the generation module 402, and the generation module 402 is also connected to the dispensing module 403:

[0053] The collection module 401 is used to collect position information of electronic components on the circuit board;

[0054] A generating module 402, configured to use the position information and preset outline size information of the electronic component to generate a dispensing area;

[0055] The glue dispensing module 403 is used for dispensing glue in the glue dispensing area.

[0056] Optional, such as Figure 5 As shown, the collection module 401 includes:

[0057] The first collecting unit 4011 is used ...

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Abstract

The invention provides a glue dispensing method and a glue dispensing device. The method comprises the following steps: acquiring position information of an electronic element on a circuit board; generating a glue dispensing region by using the position information and contour size information of the electronic element; and dispensing glue in the glue dispensing region. According to the embodiments of the invention, by the acquisition of the position information of the electronic element on the circuit board and the determination of the glue dispensing region according to the position information and the contour size information of the electronic element, an error between the glue dispensing region and an actually required glue dispensing region for the electronic element is eliminated, so that the accuracy for glue dispensing in the glue dispensing region can be improved, and the glue dispensing effect can be enhanced.

Description

technical field [0001] The invention relates to the field of communication technology, in particular to a glue dispensing method and device. Background technique [0002] With the rapid development of science and technology, more and more electronic devices have entered our daily life. When users use these electronic devices, especially when the electronic components are key switches, because the key switches are used in electronic devices such as mobile phones It provides functions such as power on and off, camera shutter, etc., so the use of key switches will be very frequent. Generally, electronic components are welded on the circuit board in the electronic equipment, and the soldered part is exposed between the electronic component and the circuit board. Therefore, when water seeps into the soldered part, it will cause poor contact or malfunction of the electronic component. In order to increase the electronic The waterproof ability of components is generally sealed by ...

Claims

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Application Information

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IPC IPC(8): B05D1/26B05D5/02B05C11/10
CPCB05D1/26B05C11/1015B05D5/02
Inventor 陈西晓谢长虹
Owner VIVO MOBILE COMM CO LTD
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