A new resistance-capacitance composite chip and its manufacturing method

A composite chip and manufacturing method technology, which is applied in the manufacture of encapsulated/shell resistors, resistors, and resistors with negative temperature coefficients, etc., which can solve the problem of lack of overvoltage protection for resistor products, affecting normal operation of circuits, and easy damage, etc. problems, to achieve the effect of preventing damage or sudden changes in resistance, preventing sudden changes in voltage, and avoiding damage

Active Publication Date: 2019-05-14
DINGSENSE ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The resistance product prepared in this way lacks the ability of overvoltage protection, and it is easy to be damaged when encountering voltage mutation or voltage backflow during use, which will affect the normal operation of the circuit

Method used

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  • A new resistance-capacitance composite chip and its manufacturing method
  • A new resistance-capacitance composite chip and its manufacturing method
  • A new resistance-capacitance composite chip and its manufacturing method

Examples

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Embodiment Construction

[0026] See figure 1 , Which is a schematic diagram of the structure of the novel resistance-capacitance composite chip of the present invention. The novel resistance-capacitance composite chip includes a resistance chip 1, a capacitor chip 2, two parallel leads 3 connected to electrodes on both sides of the resistance chip 1, and a protective layer 4 covering the outside of the resistance chip 1 and the capacitor chip 2. .

[0027] The resistor chip 1 is an NTC thermistor chip. The resistance chip 1 is clamped and fixed to the ends of the two leads 3, and the leads are soldered through a high-temperature tin furnace and high-temperature solder. The capacitor chip 2 is connected in parallel to the resistor chip 1 and is arranged between the two leads 3. The protective layer 4 is a glass protective layer.

[0028] Compared with the prior art, the novel resistance-capacitance composite chip of the present invention is provided with a capacitor chip connected in parallel with the re...

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PUM

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Abstract

The invention discloses a novel resistance-capacitance compound chip and a manufacturing method thereof. The novel resistance-capacitance compound chip comprises a resistance chip, a capacitance chip, two leads and a protective layer, wherein the resistance chip is connected with the capacitance chip in parallel; the two leads are arranged in parallel and are connected to electrodes on two surfaces of the resistance chip respectively; and the protective layer coats the resistance chip and the capacitance chip. Compared with the prior art, the novel resistance-capacitance compound chip disclosed by the invention has the advantages that a voltage jump is effectively prevented through the arrangement of the capacitance chip connected with the resistance chip in parallel; overvoltage in a peak state can be absorbed; and the damage to a device which is connected with the novel resistance-capacitance compound chip in parallel is avoided.

Description

Technical field [0001] The invention belongs to the field of electronic components, and particularly relates to a novel resistance-capacitance composite chip and a manufacturing method thereof. Background technique [0002] The existing resistance products are independent and single components, and the existing manufacturing process is usually: putting the resistance chip and lead into a tin furnace for welding processing and then encapsulating and testing. The resistance product prepared in this way lacks the ability of overvoltage protection, and it is easy to be damaged if it encounters a sudden voltage change or a voltage backflow phenomenon during use, thereby affecting the normal operation of the circuit. Summary of the invention [0003] The purpose of the present invention is to overcome the shortcomings and deficiencies in the prior art and provide a new type of resistance-capacitance composite chip and a manufacturing method thereof. The new type of resistance-capacitanc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C13/00H01C7/04H01C17/02
CPCH01C7/04H01C13/00H01C17/02
Inventor 黄贵龙段兆祥杨俊唐黎民
Owner DINGSENSE ELECTRONICS TECH CO LTD
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