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Semiconductor device and manufacturing method thereof

A semiconductor and device technology, applied in the field of semiconductor devices and their manufacturing, can solve the problem that the passivation layer cannot cover the periphery of the chip, etc.

Active Publication Date: 2016-12-21
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this passivation layer cannot cover the periphery of each chip

Method used

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  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof
  • Semiconductor device and manufacturing method thereof

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Embodiment Construction

[0035] The following disclosure provides many different embodiments or examples for implementing different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the invention. Of course, these are only examples and are not intended to limit the invention. For example, in the following description, forming the first member above or on the second member may include an embodiment in which the first member and the second member are formed in direct contact, and may also include that the first member may be formed between the first member and the second member. Additional components, so that the first component and the second component may not directly contact the embodiment. In addition, the present invention may repeat reference numerals and / or characters in each example. This repetition is for the purpose of simplicity and clarity, and by itself does not indicate the relationship between the various embodiments...

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Abstract

A semiconductor device includes an integrated circuit, at least one outer seal ring, and at least one inner seal ring. The outer seal ring surrounds the integrated circuit. The outer seal ring includes a plurality of metal layers in a stacked configuration, and the metal layers are closed loops. The inner seal ring is disposed between the outer seal ring and the integrated circuit and separated from the outer seal ring. The inner seal ring has at least one gap extending from a region encircled by the inner seal ring to a region outside the inner seal ring. The invention also provides a method for manufacturing the semiconductor device.

Description

Technical field [0001] The present invention relates to the field of semiconductors, and more specifically to semiconductor devices and manufacturing methods thereof. Background technique [0002] Generally, integrated circuits are manufactured on a wafer at the same time in multiples. Once manufacturing is complete, the wafer is sawed into individual chips. The uppermost surface of the chip is usually protected by a deposited passivation layer. However, the passivation layer cannot cover the periphery of each chip. Therefore, the periphery of each chip is exposed to undesirable moisture and ionic contaminants. Therefore, the "sealing ring" also called "guard ring" is usually formed of at least one metal strip, before sawing the wafer, as part of IC die manufacturing, the sealing ring is formed around at least the upper periphery of each chip . These sealing rings can provide structural reinforcement and prevent undesirable moisture and mobile ionic contaminants from enterin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/28H01L23/31
CPCH01L23/28H01L23/31H01L23/564H01L23/585H01L2924/143H01L2924/141H01L2924/14H01L2924/1421H01L23/562
Inventor 杨名慧廖浚廷陈益德陈程元刘和昌
Owner TAIWAN SEMICON MFG CO LTD