Welding flux position adjusting device assisting in working of weldable testing instrument

Abstract

The invention discloses a welding flux position adjusting device assisting in working of a weldable testing instrument. The welding flux position adjusting device comprises a lifting device, a rectangular first flat plate is fixed to the lifting device, first sliding grooves are formed in the upper surface of the first flat plate in the long-axis direction, a first driving device and a second flat plate connected with the driving end of the first driving device are arranged on the upper surface of the first flat plate, and the second flat plate slides along the first sliding grooves. Second sliding grooves are formed in the upper surface of the second flat plate and are perpendicular to the first sliding grooves, a second driving device and a sliding block connected with the second driving device are arranged on the second flat plate, the sliding block slides along the second grooves, and a welding flux groove is formed in the surface of the sliding block. The welding flux position adjusting device assisting in working of the weldable testing instrument is provided for solving the problem that in the prior art, pins of a sample to be measured often cannot rightly face the center of a welding ball, and achieves the purposes of quickly adjusting welding flux and making the pins of the sample to be measured rightly face the center.

Description

technical field [0001] The invention relates to the field of solderability testers, in particular to a solder position adjustment device for assisting the work of the solderability tester. Background technique [0002] Solderability test refers to the qualitative and quantitative evaluation of the solderability of components, PCB boards, PADs, solders and fluxes, etc. through the wetting balance method. Both level 1 (IC packaging) and level 2 (assembly of electronic components to printed circuit board) processes in the modern electronics industry require high-quality interconnection technology, as well as high-quality and zero-defect soldering processes. Solderability testing is generally used to make a qualitative and quantitative evaluation of the solderability of components, printed circuit boards, solder and flux, etc. In the assembly welding process of electronic products, the welding quality directly affects the quality of the whole machine. Therefore, in order to im...

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Problems solved by technology

[0003] The invention proposes a solder position adjustment device that assists the work of a solderability tester to solve the problem in the prior art that the pins of the samples to be tested often cannot be directly at the center of the solder balls, and realize rapid adjustment of the solder to make the solder position The purpose of measuring the pin alignment of the sample

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