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A kind of anti-oxidation tin plating solution based on yttrium bismuth phosphorus

A tin plating solution and anti-oxidation technology, applied in hot dip plating process, coating, metal material coating process, etc. The problem of high cost of oxidizing agent can achieve the effect of low cost, inhibiting oxidation and improving wettability.

Active Publication Date: 2019-05-17
XIAN TELISON NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing antioxidants on the market are relatively expensive, highly targeted, and the effect of antioxidation is not ideal, and they are mainly based on organic solvents, which will bring problems such as waste liquid recovery and environmental pollution. There are few practical use cases for improving the oxidation resistance of tin melts

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Take two parts of 100g tin plating solution, which are respectively recorded as 1# and 2#. Under the condition of temperature 230°C, add yttrium, bismuth and phosphorus to 1# tin plating solution at the same time; among them, based on the weight of tin plating solution, The weight percentages of added yttrium, bismuth, and phosphorus are 0.02%, 0.04%, and 0.02% respectively, and yttrium is added in the form of yttrium-tin master alloy, and the yttrium content is 1% of the mass of the yttrium-tin master alloy; bismuth Add in the form of bismuth-tin master alloy, and the bismuth content is 1% of the mass of the bismuth-tin master alloy; phosphorus is added in the form of phosphorus-tin master alloy, and the phosphorus content is 1% of the mass of the phosphorus-tin master alloy. 5%.

[0025] 2# tin plating solution is the blank control group. After oxidizing 1# and 2# tin plating solutions for 5 hours respectively (oxidation conditions: heating at room temperature to 230°...

Embodiment 2

[0041] This embodiment takes the industrial tin-plated copper production line as an example, the tin melt of 20kg is filled in the tin furnace of the tin-plated copper production line, and the temperature is 225-235 ℃. Add 0.2kg-0.4kg of 1% yttrium-tin master alloy, 0.2kg-0.8kg of 1% bismuth-tin master alloy, and 0.08kg-0.16kg of 5% phosphorus-tin master alloy to obtain the anti-oxidation agent based on yttrium-bismuth-phosphorus Tin plating solution; then perform hot tinning on the oxygen-free red copper strip at a speed of 80m / min.

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PUM

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Abstract

The invention belongs to the technical field of metal anti-oxidation protection and particularly discloses an anti-oxidation tinning solution based on yttrium, bismuth and phosphorus. The anti-oxidation tinning solution comprises the following components of yttrium, bismuth, phosphorus and tin and includes, by weight percent, 0.005%-0.02% of yttrium, 0.004%-0.05% of bismuth and 0.01%-0.05% of phosphorus with the weight of tin as the benchmark. Yttrium, bismuth and phosphorus are added into the tin solution, oxidization of the tinning solution can be effectively inhibited, the wettability of the tinning solution is improved, generation of tin slag is reduced, the tin product yield is increased, productivity of the hot tinning product is improved, and other physical and mechanical properties of the tinning product are not affected. The anti-oxidation tinning solution is low in cost, an existing production technology is not changed, daily caring and maintaining of existing equipment are not affected, the environment-friendly requirement is met, and the working environment of a production place is not affected.

Description

technical field [0001] The invention relates to the technical field of metal anti-oxidation protection, in particular to an anti-oxidation tin plating solution based on yttrium bismuth phosphorus, which is mainly used for photovoltaic welding strips. Background technique [0002] With the rapid development of the electronics industry, tin-based alloys are widely used in photovoltaic ribbons, electronic packaging and other fields because of their low melting point, good corrosion resistance, and good bonding with metal substrates. However, the liquid tin alloy in the molten state is easily oxidized to form tin dross and tin lumps, which contain a large amount of unoxidized tin, resulting in insufficient utilization of raw materials, production waste, increased production costs, and also affects product quality. In addition, during the production process of photovoltaic ribbon, the oxidation of tin alloy in the tin furnace will also cause color difference on the surface of the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C2/08C22C1/03C22C13/00C22C13/02
CPCC22C1/03C22C13/00C22C13/02C23C2/08
Inventor 张辉陈庆谊年有权孟瑜李少萌成佳佳刘艳洁孔伊莎
Owner XIAN TELISON NEW MATERIAL
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