Unlock instant, AI-driven research and patent intelligence for your innovation.

Photomask-integrated micromolding method

A photomask integrated micro and molding technology, applied in optics, optomechanical equipment, instruments, etc., can solve the problems of harsh experimental conditions, high cost, unfavorable large-scale preparation, etc., to reduce processing time and cost, improve The effect of production efficiency

Active Publication Date: 2019-11-05
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although micro-stereolithography and two-photon polymerization can produce three-dimensional microstructures with good quality and precision, the processing technology is complicated, the experimental conditions are harsh, and the cost is high, which is not conducive to large-scale preparation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photomask-integrated micromolding method
  • Photomask-integrated micromolding method
  • Photomask-integrated micromolding method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0034] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process conversion made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technical fields , are all included in the scope of patent protection of the present invention in the same way.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field of the invention. The terminology used herein in the description of the present invention is only for ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
surface roughnessaaaaaaaaaa
Login to View More

Abstract

The invention provides a photomask integration micro-moulding method. The method is simple and is low in cost. According to the method, the production efficiency can be improved. The method comprises the steps of S101, carrying out coating on the surface of a microscope glass slide to form a sacrificial layer and carrying out roasting; S102, dripping photoresist in a cavity of a miniature die and covering the cooled microscope glass slide; S103, carrying out preheating before exposure on the miniature die, namely, selecting multiple temperatures from a range of 50-100 degrees centigrade for roasting in an ascending sequence; S104, exposing the miniature die under irradiation of an ultraviolet light source, thereby enabling a nanocomposite material in the cavity to be cured; S105, carrying out roasting after the miniature die is exposed, namely, selecting multiple temperatures from the range of 50-100 degrees centigrade for roasting in the ascending sequence; S106, cooling the miniature die to a room temperature, demoulding from the die, moving away the glass slide and a three-dimensional microstructure, and removing uncross-linked thin film; and S107, washing and drying the three-dimensional microstructure.

Description

technical field [0001] The invention relates to the technical field of micro-electro-mechanical systems, in particular to a method for integrating micro-plastics with photomasks. Background technique [0002] The application of Micro-Electro-Mechanical Systems (MEMS) has attracted more and more attention, and it plays an important role in the fields of aerospace technology, electronic instruments, bionic technology and medical equipment. From microsensors to monitoring chips, from aerospace instruments to optical devices, all MEMS are composed of three-dimensional microstructures. Micro-electro-mechanical systems are characterized by ultra-miniaturization, often in micron and sub-micron sizes, and no longer meet the concepts and laws of macro-mechanical electronic devices in terms of manufacturing process, integration, and working principles. New microfabrication methods have made significant progress against this background. [0003] Current micromachining methods include...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/00
CPCG03F7/0035
Inventor 李晖陈静张南南王磊
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI