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Method for keeping backpressure of wafer steady

A wafer and back pressure technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as wafer back pressure cannot enter, alarms, etc.

Inactive Publication Date: 2017-01-04
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, when the wafer is in a stable process, when there are scratches or passivation on the back of the wafer, it will directly cause the back pressure of the wafer to fail to enter the range required by the process, resulting in machine alarms

Method used

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  • Method for keeping backpressure of wafer steady

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Embodiment Construction

[0024] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0025] In the present invention, the back pressure value when the wafer is stable is read by the pressure gauge, and when the read back pressure value is lower than the range required by the process, the back pressure value is increased by automatically increasing the voltage of the wafer on the tray , until the back pressure enters the range required by the process, the tray voltage is maintained until the processing of the wafer is completed. The method automatically adjusts the voltage of the wafer on the pallet, thereby ensuring that the back pressure of the wafer is stable within the range required by the process.

[0026] figure 1 A flow chart of a method for maintaining stable wafer back pressure according to a preferred embodiment of th...

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PUM

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Abstract

The invention provides a method for keeping backpressure of a wafer steady. The method comprises the following steps of: putting the wafer on an electrostatic chuck; enabling the electrostatic chuck to provide one set tray voltage for the wafer; introducing gas into the wafer; enabling the backpressure of the wafer to be steady after introducing gas into the wafer; judging whether the backpressure of the wafer accords with process requirements or not after the backpressure of the wafer is steady; when the fact that the backpressure of the wafer does not accord with the process requirements is determined, adjusting the set numerical value of the tray voltage according to the backpressure of the waver, and then, returning to the second step again; and executing a treatment process when the fact that the backpressure of the wafer accords with the process requirements is determined.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, and more specifically, the invention relates to a method for maintaining stable wafer back pressure. Background technique [0002] During wafer processing, generally after the wafer reaches the electrostatic chuck, the electrostatic chuck first provides a constant chuck voltage to the wafer, so that the wafer is subjected to a downward pressure, and then the wafer is placed on the electrostatic chuck. The gas is fed into the back, and the processing starts after the back pressure is stable and reaches the range required by the process. [0003] However, when the wafer is in a stable process, when there are scratches or passivation on the back of the wafer, it will directly cause the back pressure of the wafer to fail to enter the range required by the process, resulting in machine alarms. When re-working, it is necessary to manually adjust the voltage value of the tray, so that the bac...

Claims

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Application Information

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IPC IPC(8): H01L21/02H01L21/683
CPCH01L21/02H01L21/6831
Inventor 朱亮柳小敏陈伟邰晓东
Owner SHANGHAI HUALI MICROELECTRONICS CORP
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