A press-fitting device and a press-fitting method for a semiconductor valve string

Abstract

The invention provides a press mounting apparatus and press mounting method of a semiconductor valve string. The press mounting apparatus comprises a horizontal workbench arranged on a frame, the horizontal workbench is provided with a guiding support mechanism used for guiding and supporting each device in a semiconductor valve string to be press-mounted, a force application mechanism is arranged at the end of a guiding direction on the frame, and the force application direction of the force application mechanism is the same as the guiding direction. The advantages are as follows: each device in the semiconductor valve string is horizontally placed on the guiding support mechanism for assembling, compared to a conventional vertical accumulation placement method, the method reduces transport paths, and therefore, the labor intensity is low and the assembling efficiency is high. Besides, the semiconductor valve string does not have to be hoisted and moved after being assembled, pressure loading can be carried out directly by use of the force application mechanism, the press-mounting efficiency and the automation degree of the whole press-mounting operation are improved, and the press-mounting precision is effectively guaranteed. At the same time, the height of the horizontally arranged semiconductor valve string is greatly reduced, and the press-mounting stability of the semiconductor valve string is improved.

Description

technical field [0001] The invention relates to a press-fitting device and a press-fitting method for a semiconductor valve string. Background technique [0002] At present, my country has completed the South Australia three-terminal ±160kV and Zhoushan five-terminal ±200kV flexible DC transmission projects, but due to the lack of core equipment - DC circuit breakers, the advantages of the projects have not been brought into play. The DC circuit breaker is the core equipment in the flexible DC transmission project, which is mainly composed of a pressure-connected IGBT valve string. [0003] At present, when large-scale semiconductor devices such as IGBTs are modularized and integrated, they mainly adopt manual stacking and vertical pressing. Connected IGBT package module press-fit test fixture, including the first fixed plate set, the first conductive plate, the first water-cooled heat dissipation set, the second conductive plate, the second water-cooled heat dissipation se...

AI Technical Summary

Problems solved by technology

At this time, if this artificial vertical stacking method is adopted, the upper components are placed on the basis of the lower components. As the number of components increases, tolerance accumulation will be formed. The assembly centers of each component are not on the same vertical line, and the assembly accuracy It is difficult to guarantee, resulting in large differences between IGBT valve strings of the same model, and the standardization of integrated modules is low

At the same time, due to the large number of components, as the height of the module increases, the transportation path will inevitably increase, resulting in high labor intensity and low assembly efficiency

[0005] In addition, due to the vertical assembly used in the prior art, the entire device needs to be hoisted and moved to the press after the assembly is completed, which greatly affects the production efficiency. The assembly accuracy is destroyed, which affects the accuracy after press-fitting, and because the height of the IGBT valve string is high, when the vertical pressure is applied, the entire module is unstable during the press-fitting process

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