Power package with integrated magnetic field sensor

A magnetic field sensor and packaging technology, which is applied in the fields of magnetic field controlled resistors, parts of electromagnetic equipment, devices applying electro-magnetic effects, etc., which can solve the problems of needing calibration work and increasing costs, etc.

Active Publication Date: 2017-01-04
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Sensing accuracy can be improved to e.g. +/- 2% by user ...

Method used

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  • Power package with integrated magnetic field sensor
  • Power package with integrated magnetic field sensor
  • Power package with integrated magnetic field sensor

Examples

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Embodiment Construction

[0023] Embodiments described herein provide for integrating a magnetic field sensor, such as a magnetoresistive (XMR) sensor or a Hall sensor, into a power semiconductor package for integrated current and / or temperature measurement. The magnetic field sensor generates a signal in response to a magnetic field generated by a current flowing in a current path of a power semiconductor die included in the package. The magnitude of the signal is proportional to the amount of current flowing in the current path and is indicative of the current consumption of the power semiconductor die and / or the temperature of the package. The power semiconductor package may or may not be provided with galvanic isolation between the magnetic field sensor and the power semiconductor die. In each case, the magnetic field sensor may be integrated into the same power semiconductor package as the power semiconductor die for which current and / or temperature measurements are desired. For example, a magnet...

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Abstract

The invention provides a power package with an integrated magnetic field sensor. A power semiconductor package includes a substrate having a plurality of metal leads, a power semiconductor die attached to a first one of the leads and a magnetic field sensor integrated in the same power semiconductor package as the power semiconductor die and positioned in close proximity to a current pathway of the power semiconductor die. The magnetic field sensor is operable to generate a signal in response to a magnetic field produced by current flowing in the current pathway, the magnitude of the signal being proportional to the amount of current flowing in the current pathway.

Description

technical field [0001] The present application relates to power semiconductor packages, and in particular, to power semiconductor packages with integrated magnetic field sensors. Background technique [0002] A power package includes one or more power semiconductor dies, such as power transistors and / or power diode dies, attached to a substrate, such as a lead frame or a ceramic substrate with a patterned metallized surface. In each case, accurate current and / or temperature measurements are required to ensure reliable and safe operation of the power package. Some current / temperature sensors are implemented using external components such as resistive shunts that are highly accurate but complicate package design. Other conventional approaches integrate electrical type sensors in power semiconductor dies. This approach reduces the complexity of the package design, but at the expense of reduced accuracy. Typical integrated electrical type sensors such as diodes (whose voltage...

Claims

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Application Information

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IPC IPC(8): H01L25/16
CPCH01L25/16H01L2224/40245H01L2224/48137H01L2224/48247H01L2224/4903G01R33/007H01L2224/371H01L2224/37147H01L23/3735H01L23/4952H01L23/49524H01L23/49562H01L23/49589H01L23/62H01L23/49575G01R33/09G01R33/07H10N50/00H10N50/10H10N50/80H10N52/80H01L23/3107
Inventor G·A·巴布拉诺L·陈M·丁克尔F·约斯特S·米斯林格尔J·厄特延T·萨尔米宁
Owner INFINEON TECH AG
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