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A kind of total reflection array substrate and its manufacturing method and display device

A technology of an array substrate and a manufacturing method, applied in the field of a total reflection array substrate and a manufacturing method thereof and a display device, can solve problems such as metal corrosion, and achieve the effect of improving production yield

Inactive Publication Date: 2019-11-05
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of this, the present invention provides a total reflection array substrate and its manufacturing method and display device, which are used to solve the problem that the metal under the via holes in the peripheral area is easily destroyed by the etching solution of the metal reflection layer during the production process of the total reflection array substrate. corrosion problem

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  • A kind of total reflection array substrate and its manufacturing method and display device
  • A kind of total reflection array substrate and its manufacturing method and display device
  • A kind of total reflection array substrate and its manufacturing method and display device

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Embodiment Construction

[0049] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the described embodiments of the present invention belong to the protection scope of the present invention.

[0050] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. "First", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or importance, but are only used to distinguis...

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Abstract

The invention provides a total-reflection array substrate, a manufacturing method thereof and a display device with same. The manufacturing method comprises the steps of forming a pattern of a first metal layer and a pattern of a first insulating layer, wherein the pattern of the first insulating layer comprises a pattern of a switching through hole in a peripheral area, and the pattern of the first metal layer comprises a metal pattern at the bottom of the switching through hole; forming a transparent metal oxide conductive layer and a pattern of a second insulating layer, wherein the pattern of the transparent metal oxide conductive layer comprises a transparent switching wiring pattern in the switching through hole area, and the pattern of the second insulating layer comprises an insulation protecting pattern which is arranged above the transparent switching wiring pattern; and forming the pattern of a second metal layer, wherein the pattern of the second metal layer comprises a metal reflecting pattern in a displaying area, and performing wet etching on the second metal layer of the switching through hole area in forming the pattern of the second metal layer. Because the insulation protecting pattern performs a protecting function on the metal pattern at the bottom of the through hole, metal pattern corrosion by etching liquid used in wet etching can be prevented.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a total reflection array substrate, a manufacturing method thereof, and a display device. Background technique [0002] In the production process of the current total reflection array substrate, after depositing the last layer of ITO layer, it is necessary to deposit a metal reflective layer (the metal reflective layer is on the top of the film layer, which is beneficial to improve the reflectivity), and the metal reflective layer The patterning process includes photoresist coating, exposure, development, etching, stripping photoresist and other steps. In the etching step, due to the insufficient density of ITO, at the via holes in the peripheral area of ​​the array substrate, for The etchant for etching the metal reflective layer will penetrate the ITO layer in the via hole, causing corrosion of the metal below the via hole, thereby reducing the production yield of the total re...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L21/77H01L27/12H01L27/1214H01L27/1259H01L2021/775
Inventor 张正东杨小飞莫再隆代科
Owner BOE TECH GRP CO LTD