A Method of Dynamically Adjusting the Safety Grinding Time Limit
A grinding time and dynamic adjustment technology, applied in the direction of grinding equipment, grinding machine tools, metal processing equipment, etc., can solve the problems of increased rework rate, uncertain grinding time, product thinning and scrapping, etc.
Active Publication Date: 2018-06-26
SHANGHAI HUALI MICROELECTRONICS CORP
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Problems solved by technology
[0003] Since the BRA and RR values are not necessarily consistent with the actual values, the calculated grinding time is not necessarily accurate. Therefore, a safe grinding time limit is usually given according to the running situation of the production line. If the safety time limit is too tight, When the grinding rate changes greatly, the thickness of the ground product will be far from the target value, and the rework rate will increase. If the safety time limit is wide, the chance of product grinding and scrapping will be affected by the change of grinding rate. will increase
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[0027] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.
[0028] figure 1 A flow chart of a method for dynamically adjusting the safety grinding time limit according to a preferred embodiment of the present invention is schematically shown.
[0029] Such as figure 1 As shown, the method for dynamically adjusting the safety grinding time limit according to a preferred embodiment of the present invention includes:
[0030] The first step S1: Obtain the lower limit of the empirical safety time T LCL and is the upper limit of the empirical safety time T UCL ;
[0031] The second step S2: obtain the reference grinding rate RR according to the long-term grinding rate average value;
[0032] The third step S3: Obtain the grinding rate of the control plate according to the monitoring of the control plate ...
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The invention provides a method for dynamically regulating a safe grinding time limit. The method comprises the steps that first step, an experience safety time lower limit TLCL and an experience safety time upper limit TUCL are obtained; second step, the standard grinding rate RR is calculated according to long-term grinding rate mean value; third step, the gear control piece grinding rate is obtained through gear control piece monitoring, and the real-time grinding rate RRi is obtained through APC feedback; fourth step, the grinding rates RRi-, ...1 andRRi-a of previous a batches of current batches are obtained; fifth step, a feedback proportional coefficient k is obtained according to feedback intensity of actual feedback adjustment; sixth step, the number a of real-time grinding rate batches is calculated; seventh step, the real-time safe time limit TLCLi: TLCLi = TLCL-K * TLCL * [(RRi + RRi-1 +... + RRi-a) / (a + 1)-RR] / RR is calculated according to a first formula.
Description
technical field [0001] The invention relates to the field of semiconductor manufacturing and related fields of APC, more specifically, the invention relates to a method for dynamically adjusting the safety grinding time limit. Background technique [0002] In the automatic power control (Advance Process Control, APC) feedback process, through the calculation of BRA (BlanketRemove Amount) and RR (Remove Rate), finally give the grinding time to grind the wafer. BRA is the removal amount of this grinding. For a film with a single structure, the previous value minus the target value is the removal amount of the current grinding, and it has a specific graphic effect on the product. In CVD (chemical vapor deposition) deposition After the accumulation, the surface has different ups and downs, so the determination of BRA is also obtained through the actual Pilot Run (test run), which is not consistent with the actual value. The RR (Chemical Mechanical Polishing Rate) is usually aff...
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IPC IPC(8): B24B37/005
CPCB24B37/005
Inventor 吴科同小刚文静张传民
Owner SHANGHAI HUALI MICROELECTRONICS CORP