Preparation method of microwave copper-clad laminate while maintaining low thermal expansion coefficient in three axes
A technology with low thermal expansion coefficient and shaft retention, applied in chemical instruments and methods, lamination, adhesive additives, etc., can solve the problems of limited adjustable range and large difference in dielectric constant, and achieve insufficient rigidity and low manufacturing cost , Environmentally friendly effect
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[0027] The present invention provides a method for preparing a microwave copper-clad laminate with low thermal expansion coefficient in three axes, wherein the three axes refer to the X, Y, and Z axes of the impregnated dielectric board. The preparation method of microwave copper clad laminate comprises the following steps:
[0028] Step (1), prepare the adhesive sheet, the preparation method of the adhesive sheet is: add appropriate amount of fluororesin to modify the PTFE emulsion, add mixed ceramic powder, reinforcing fiber and a certain amount of surface modifier, dilute with deionized water into different Concentration and viscosity, stir evenly, such as heating and stirring in a high-speed mixer at 20-70°C for 10-60min, the stirring speed is 1000-3000rpm; immerse the PTFE porous membrane in the above-mentioned uniform solution of different concentrations for 10-30s, 2 to 5 times the solution, adjusted to the predetermined thickness. Dry the dipped film at 50-120°C for 2...
Embodiment 1
[0051] (1) According to each component specified in Example 1 in Table 1, add FEP, amorphous SiO in PTFE emulsion 2 and surface modifier F8261, diluted with deionized water to a concentration of 35% solid content, stirred in a high-speed mixer at 20°C for 10min, and the stirring speed was 1000rpm. The solvent is configured into different concentrations of 85%, 70%, 50%, 30%, and 15%, so that the PTFE porous membrane with a thickness of 40 μm and a porosity of 80% is immersed in the above solution in order from high to low concentration, A total of 5 times of dipping for 30s each time. Dry the dipped film at 50°C for 5 minutes to remove moisture, then dry at 200°C for 5 minutes to remove low-temperature volatiles such as dispersants, and finally dry at 370°C for 20 minutes to obtain an adhesive sheet with uniform thickness and smooth surface.
[0052] (2) The preparation method of the microwave copper-clad laminate is as follows: stack five adhesive sheets obtained in step (1)...
Embodiment 2
[0054] (1) according to each component specified in embodiment 2 in table 1 respectively, add PFA, amorphous SiO in PTFE emulsion 2 、Al 2 O 3 , glass microfiber, surface modifier F8261 and AN, diluted to a concentration of 40% solid content with deionized water, stirred in a high-speed mixer at 40°C for 20min, and the stirring speed was 2000rpm. The solvent is configured into different concentrations of 80%, 65%, 40%, and 20%, so that the PTFE porous membrane with a thickness of 40 μm and a porosity of 80% is immersed in the above solutions in order from high to low in concentration. A total of 4 times of immersion in 20s. Dry the impregnated film at 80°C for 3 minutes to remove moisture, then dry at 300°C for 3 minutes to remove low-temperature volatiles such as dispersants, and finally dry at 380°C for 15 minutes to obtain an adhesive sheet with uniform thickness and smooth surface.
[0055] (2) The preparation method of the microwave copper-clad laminate is as follows: s...
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