Chip security testing method and system based on fault injection

Abstract

The embodiment of the present invention provides a chip security testing method and system based on fault injection, wherein the method includes: sequentially focusing the femtosecond laser on different positions on the surface of the chip to be tested through a synchronous control unit, and different parts of the chip to be tested Fault injection is performed at the position, wherein the femtosecond laser produces two-photon absorption in the chip to be tested, so that the logic unit in the chip to be tested is flipped; when the chip to be tested is irradiated by the femtosecond laser to different positions, Collecting the operation results output by the chip to be tested respectively; comparing and analyzing the collected operation results with the preset correct operation results of the chip to be tested, and determining whether an effective fault occurs at the position where the chip to be tested is irradiated by the femtosecond laser, The number of positions where effective faults occur is the basis for judging the safety degree of the chip under test. This solution can improve the accuracy of fault injection, and is beneficial to improve the success rate of chip security testing based on fault injection.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip security testing method and system based on fault injection. Background technique [0002] With the development of space technology and nuclear technology, semiconductor ionizing radiation effects (also known as single event effects) are further classified and studied, such as single event latch-up (Single event latch-up, SEL for short), single event upset (Single event upset, SEU for short), single event functional interrupt (Single event functional interrupt, SEFI for short), and single event burnout (Single event burnout, SEB for short), etc. According to whether the impact of single event effects on electronic components can be recovered, single event effects can be divided into unrecoverable errors and recoverable errors. "Non-recoverable error" or "hard error" refers to an error that will cause fatal and permanent damage to the device or system once it occurs, ...

AI Technical Summary

Problems solved by technology

[0009] The embodiment of the present invention provides a chip security testing method based on fault injection to solve the technical problem in the prior art that high-precision fault injection testing cannot be performed when the semiconductor manufacturing process develops from micron to deep submicron or even nanometer nodes

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