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Manufacturing method for micro-component transfer adapter

A manufacturing method and technology of micro-components, which are applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., and can solve problems such as thermal budget limitation and performance degradation of micro-components

Active Publication Date: 2017-01-11
XIAMEN SANAN OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the fabrication process using transfer head arrays, the thermal budget of microcomponents for phase change is limited, usually less than 350 °C, or more specifically, less than 200 °C; otherwise, the performance of microcomponents will be degraded

Method used

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  • Manufacturing method for micro-component transfer adapter
  • Manufacturing method for micro-component transfer adapter
  • Manufacturing method for micro-component transfer adapter

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiments of the present invention describe a transposition head for transferring micro components and a method for transferring micro components using the transposition head. Among them, micro-components can be micro-LED devices, diodes, transistors, integrated circuit (IC) chips, etc., and their size can be 1-100 μm, but they are not necessarily limited thereto, and some aspects of the embodiments are applicable to larger and more small size.

[0026] Figure 1~Figure 5 A schematic diagram of the manufacturing process of a transposition head for micro-component transfer is shown, which mainly includes the following process steps:

[0027] Please refer to the attached figure 1 , provide a package 302, the material of the package can be metal or silicon or ceramics or glass or plastic or any combination of the foregoing, silicon substrate is preferred as the material of the package in this embodiment.

[0028] Please refer to the attached figure 2 , fabricate an ...

Embodiment 2

[0038] Please refer to the attached Figure 7 The difference from Example 1 is that the arrayed micropore structure 3021 of this embodiment is formed using through-silicon via technology (TSV), and the depth of the perforation is less than 20 μm. The circular diameter W of the arrayed micropore structure 3021 is between 1 and 100 μm. The distance D is between 1-100 μm, and the size of the first opening 3022 is smaller than that of the second opening 3023 , which is more conducive to exerting the adsorption effect of the suction nozzle. In addition, in this embodiment, a functional layer 306 is formed on the inner surface of the arrayed micropore structure, such as a conductive layer or an insulating layer or other functional layers, preferably a metal strengthening layer as the functional layer.

Embodiment 3

[0040] Please refer to the attached Figure 8 The difference from Embodiment 1 is that in this embodiment, a suction nozzle is made at the second opening 3023 of the arrayed microporous structure 3021, and the material of the suction nozzle can be selected from metal or silicon or ceramics or glass or plastic or any combination of the foregoing, In this embodiment, Teflon plastic is preferred. The manufacturing process of the suction nozzle can be selected such as wire drawing process or through silicon via technology (TSV) or laser treatment or any combination of the aforementioned process technologies, preferably achieved by wire drawing process.

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Abstract

The invention discloses a manufacturing method for micro-component transfer adapter. The method comprises a cavity with a vacuum path and a sleeving component with arrayed nozzles and arrayed vacuum path components. The nozzles are designed to be communicative with the vacuum path components respectively. The vacuum path components are formed to be communicative with the vacuum path in the cavity respectively. The nozzles absorb or release the micro-components through vacuum pressure. The vacuum pressure is transmitted from the vacuum path components and the vacuum path in each channel. When the sleeving component is installed on the cavity, the upper surface of the sleeving component is provided with photoelectric switch components to control the turn-on and turn-off of the vacuum path components and the vacuum path in each channel so as to further control the nozzles to absorb or release the micro-components through the vacuum pressure. The invention is characterized in preparing a sleeving component with an arrayed microporous structure, which is used as a vacuum path component or a nozzle.

Description

technical field [0001] The present invention relates to a micro-element used for display, and more particularly, to a method for manufacturing a transposition head used for micro-element transfer. Background technique [0002] Micro-component technology refers to an array of micro-sized components integrated at high density on a substrate. At present, micro-pitch light-emitting diode (Micro LED) technology has gradually become a research hotspot, and the industry expects high-quality micro-component products to enter the market. High-quality fine-pitch light-emitting diode products will have a profound impact on traditional display products such as LCD / OLED that are already on the market. [0003] In the process of fabricating microcomponents, the microcomponents are first formed on a donor substrate and then transferred to a receiving substrate. The receiving substrate is, for example, a display screen. One difficulty in the fabrication of microcomponents is how to trans...

Claims

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Application Information

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IPC IPC(8): H01L21/683
CPCH01L21/6838
Inventor 徐宸科郑建森邵小娟时军朋林科闯
Owner XIAMEN SANAN OPTOELECTRONICS TECH CO LTD