Installation method of power semiconductor device and controller shell
A technology of power semiconductors and installation methods, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as easy failure and inability to dissipate heat in time, and achieve good heat dissipation.
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[0019] The idea, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings, so as to fully understand the purpose, features and effects of the present invention.
[0020] figure 2 Shown is the first embodiment of the present invention, the housing includes the bottom 1 of the housing, the left side of the housing 2 and the right side of the housing 3, the left side of the housing 2 is installed with a left cooling plate 21, and the right side of the housing 3 is installed The right cooling plate 31 and power semiconductor devices (not shown in the figure) are installed on the left cooling plate 21 and the right cooling plate 31 respectively. The heat dissipation fins of the left heat dissipation plate 21 are located between the left side of the housing 2 and the power semiconductor device, and the fans blow air against the heat dissipation fins. Housing right side 3 can offer heat dissipati...
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Abstract
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