Installation method of power semiconductor device and controller shell

A technology of power semiconductors and installation methods, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as easy failure and inability to dissipate heat in time, and achieve good heat dissipation.

Active Publication Date: 2017-01-18
东泽节能技术(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

With this installation method, the heat is more concentrated inside the casing. If the power semiconductor device generates heat in an instant, or the cooling fan fails, the heat cannot be dissipated in time, and failures are likely to occur.

Method used

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  • Installation method of power semiconductor device and controller shell
  • Installation method of power semiconductor device and controller shell
  • Installation method of power semiconductor device and controller shell

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Embodiment Construction

[0019] The idea, specific structure and technical effects of the present invention will be further described below in conjunction with the accompanying drawings, so as to fully understand the purpose, features and effects of the present invention.

[0020] figure 2 Shown is the first embodiment of the present invention, the housing includes the bottom 1 of the housing, the left side of the housing 2 and the right side of the housing 3, the left side of the housing 2 is installed with a left cooling plate 21, and the right side of the housing 3 is installed The right cooling plate 31 and power semiconductor devices (not shown in the figure) are installed on the left cooling plate 21 and the right cooling plate 31 respectively. The heat dissipation fins of the left heat dissipation plate 21 are located between the left side of the housing 2 and the power semiconductor device, and the fans blow air against the heat dissipation fins. Housing right side 3 can offer heat dissipati...

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PUM

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Abstract

The invention provides an installation method of a power semiconductor device and a controller shell. The power semiconductor device is directly or indirectly installed at the inner side wall of the controller shell. The outer side of the controller shell has a slot and a heat radiating fin which is installed in the slot. According to the installation method, the controller can be adapted to different installation occasions, and the heat radiating of the power semiconductor device is good.

Description

technical field [0001] The invention relates to a method for installing a power semiconductor device, in particular to a method for installing a power semiconductor device and a controller housing, and belongs to the field of electrical technology. Background technique [0002] Power semiconductor devices, also known as power electronic devices, are semiconductor devices capable of handling high voltage and high current. Voltage handling ranges from tens to thousands of volts, with current capabilities up to thousands of amps. Typical power processing, including frequency conversion, voltage conversion, current conversion, power management, etc. Early power semiconductor devices include: high-power diodes, thyristors, etc., which are mainly used in industry and power systems. With the rapid development of new power semiconductor devices represented by power MOSFET devices, power semiconductor devices are now very extensive. [0003] Based on the characteristics of high vo...

Claims

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Application Information

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IPC IPC(8): H01L21/52H01L23/367H01L23/373
CPCH01L21/52H01L23/3672H01L23/373
Inventor 卞光辉
Owner 东泽节能技术(苏州)有限公司
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