Heat sink gasket and laser device comprising same
A laser and heat sink technology, applied in the field of lasers, can solve the problems of large package circuit impedance, long gold wire bonding length, no space to accommodate parallel gold wires, hindering the TO-CAN packaging form, etc. The effect of impedance
Pending Publication Date: 2017-01-18
深圳市东飞凌科技有限公司
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Problems solved by technology
The conventional heat sink structure results in too long bonding length of gold wires and no space to accommodate parallel gold wires, so that the impedance introduced by the packaging circuit is too large, which hinders the development of TO-CAN packaging form to a higher speed
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[0012] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0013] It should be noted that when an element is referred to as being "fixed" or "disposed on" another element, it may be directly or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element.
[0014] It should also be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and should not be regarded as restrictive .
[0015] like Figure 1 to Figure 4 As ...
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The invention discloses a heat sink gasket and a laser device comprising the same. The heat sink gasket comprises a heat sink body vertically arranged on a tube socket, a gold-plated region positioned on the surface of the heat sink body, a solder layer arranged in the gold-plated region, and a transition region arranged on the heat sink body and insulated from the gold-plated region, wherein a laser device chip is arranged on the solder layer, the gold-plated region is electrically connected with a negative electrode pin of the tube socket through a plurality of gold bonding wires arranged in parallel, a bonding pad of the laser device chip is electrically connected with the transition region through a plurality of gold bonding wires arranged in parallel, and the transition region is electrically connected with a positive electrode pin of the tube socket through a plurality of gold bonding wires arranged in parallel. By additionally arranging the transition region, the length of the gold wires forming a circuit is shorter, and the number of the gold wires capable of being arranged in parallel is increased, thereby reducing the impedance of the circuit, making the modulatable bandwidth of the circuit wider, and enabling the circuit to reach 10 Gbps or 25 Gbps high speed digital signal transmission.
Description
technical field [0001] The invention belongs to the technical field of optical fiber communication, and in particular relates to a heat sink gasket and a laser including the heat sink gasket. Background technique [0002] At present, the optical fiber communication industry is developing rapidly, and the requirements for network bandwidth are getting higher and higher. Correspondingly, the packaging requirements for the signal light source-laser die (TO-CAN) are getting higher and higher. At present, heat sink pads that provide heat conduction, conduction and fixation functions for laser chips can only meet product packaging with a rate of 2.5Gbps and below. The conventional heat sink structure results in too long gold wire bonding length and no space to accommodate parallel gold wires, so that the impedance introduced by the package circuit is too large, which hinders the development of TO-CAN package form to a higher rate. Contents of the invention [0003] The purpose ...
Claims
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IPC IPC(8): H01S3/042H01S3/02H01S5/024H01S5/02
CPCH01S3/02H01S3/042H01S5/02H01S5/024
Inventor 温永阔
Owner 深圳市东飞凌科技有限公司