Double-light path CO2 laser processing device and method of alumina ceramics

An alumina ceramic and laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of increasing production costs, difficult to debug the processing effect, and the nozzle cannot be adjusted in horizontal position, so as to improve the processing efficiency. Efficiency, improved cutting and dicing results

Inactive Publication Date: 2017-01-25
SUZHOU DELPHI LASER
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Currently domestic conventional CO 2 Laser ceramic processing devices are all single-beam, and can only achieve single-station processing. The processing efficiency of the processing device needs to be further improved to meet the needs of mass production. The laser cutting head without protective lens is likely to cause pollution and damage to the focusing lens, which increases production in disguise. Cost, the nozzle installed on the cutting head cannot adjust the horizontal position, it is difficult to debug to get a good processing effect

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  • Double-light path CO2 laser processing device and method of alumina ceramics
  • Double-light path CO2 laser processing device and method of alumina ceramics

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Embodiment Construction

[0024] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, specific implementations will now be described in detail with reference to the accompanying drawings.

[0025] Such as figure 1 As shown, the dual optical path of alumina ceramic CO 2 The laser processing device includes two sets of optical path systems with the same optical path structure, and the first set of optical path systems both contain the first radio frequency CO 2 Laser 11, first circular polarizer 12, first beam expander 14, first laser cutting head 17, first reflector 13, second reflector 15, third reflector 16, the second set of optical path system includes the first Two RF CO 2 A laser 21 , a second circular polarizer 22 , a second beam expander 24 , a second laser cutting head 27 , a fourth reflector 23 , a fifth reflector 25 , and a sixth reflector 26 .

[0026] First RF CO 2 A first circular polarizer 12 is arranged at the output end o...

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Abstract

The invention discloses a double-light path CO2 laser processing device and method of alumina ceramics. The double-light path CO2 laser processing device comprises two light path systems of the same structure; each light path system comprises a radio frequency CO2 laser, a circular polarizer, a beam expander, a laser cutting head and three reflecting mirrors, the circular polarizers are arranged on the light path output ends of the radio frequency CO2 lasers, one reflecting mirror, the corresponding beam expander, another reflecting mirror, the other reflecting mirror and the corresponding laser cutting head are arranged on an output light path of each circular polarizer in sequence, the light path output end of each laser cutting head is over against the surface of a to-be-processed workpiece, a CO2 laser focusing lens is arranged in each laser cutting head, a protective lens is installed below each CO2 laser focusing lens, a nozzle is installed on the lower part of each laser cutting head through a position adjustment mechanism, and the front and back position and the left and right position of each nozzle can be adjusted by adjusting the corresponding position adjustment mechanism. The processing efficiency and the processing quality of an alumina ceramic substrate are increased, and the cutting and scribing process effects of the alumina substrate are improved.

Description

technical field [0001] The invention relates to a double optical path CO of alumina ceramics 2 A laser processing device and a method thereof belong to the technical field of laser processing. Background technique [0002] At present, with the rapid development and progress of modern science and technology, ceramic substrates are more and more widely used. Compared with metal substrates and resin substrates, ceramic substrates have many outstanding electrical insulation properties as electronic device substrates. Excellent high-frequency characteristics, good thermal conductivity and low thermal expansion rate, strong hardness and compatibility with electronic components, stable chemical properties, etc., so the future application of ceramics will be immeasurable. As a ceramic type, alumina ceramic substrate is one of the most widely used ceramics. The annual demand for alumina substrate in my country has exceeded 10 7 m 2 , and grow at a rate of 10-20% every year. Also ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/06B23K26/073B23K26/142B23K26/36B23K26/70
CPCB23K26/0643B23K26/073B23K26/142B23K26/36B23K26/702
Inventor 赵裕兴李清峰
Owner SUZHOU DELPHI LASER
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