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A Wafer Rotary Chuck Optimized Based on Anode Shower Head Position

A technology of anode nozzle and rotary chuck, applied in the direction of working carrier, metal processing equipment, electrical components, etc., can solve the problem of low removal rate in the central area, and achieve the effect of improving the edge polishing effect

Active Publication Date: 2020-07-28
ACM RES SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the cathode nozzle 14 will eventually obtain the result after removing the copper layer, the removal rate will be lower than that in the central area

Method used

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  • A Wafer Rotary Chuck Optimized Based on Anode Shower Head Position
  • A Wafer Rotary Chuck Optimized Based on Anode Shower Head Position
  • A Wafer Rotary Chuck Optimized Based on Anode Shower Head Position

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Embodiment Construction

[0016] The above-mentioned features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale, and components with similar related properties or characteristics may have the same or similar reference numerals.

[0017] figure 2 A schematic diagram showing a preferred embodiment of the wafer spin chuck in the stress-free polishing process of the present invention. image 3 A structural diagram of a preferred embodiment of the wafer spin chuck in the stress-free polishing process of the present invention is shown. Figure 4 A bottom view of a preferred embodiment of the wafer spin chuck in the stress-free polishing process of the present invention is shown. combine Figure 2 to Figure 4 , in the wafer rotary chuck optimized based on the position of the anode shower head in this em...

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Abstract

The invention discloses a wafer rotating chuck achieving optimization based on the position of an anode sprayer for improving the edge polishing effect. According to the technical scheme, the radius of the wafer rotating chuck achieving optimization based on the position of the anode sprayer is larger than the radius of a wafer, a circular ring is arranged on the part, beyond the wafer, of the chuck, a wafer groove is formed in the middle of the chuck and used for adsorbing the wafer, a power source, a cathode sprayer and the anode sprayer are arranged below the chuck, the position of the anode sprayer is fixed relative to the wafer, and the projection of a polishing solution sprayed by the anode sprayer is located in the circular ring.

Description

technical field [0001] The invention relates to a wafer rotary chuck in stress-free polishing, in particular to a wafer rotary chuck capable of improving the edge polishing effect. Background technique [0002] Among the existing SFP (stress-free polishing) technology, the structure of the wafer spin chuck 11 is as follows: figure 1 As shown, the connection between the positive and negative poles of the power supply 12 and the wafer 13 is realized through the polishing liquid joint, and the two-stage connected polishing liquid is sprayed out by the cathode shower head 14 and the anode shower head 15 respectively, wherein the position of the anode shower head 15 is opposite to the edge The polishing effect is greatly affected. [0003] The position of the anode nozzle 15 is as figure 1 As shown, the projected area of ​​the sprayed polishing liquid is within the area of ​​the wafer 13 . Because the polishing liquid contains a certain amount of copper ions, during the polish...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/30B24B57/02H01L21/683
CPCB24B37/30B24B57/02H01L21/683
Inventor 代迎伟金一诺王坚王晖
Owner ACM RES SHANGHAI