Testing method and apparatus for LTCC substrate with inwardly embedded micro channel
A testing method and a testing device technology, which are applied in the testing field and can solve problems such as deformation and collapse of the cavity wall of a microchannel, collapse, and difficulty in processing.
Active Publication Date: 2017-02-01
PEKING UNIV SHENZHEN GRADUATE SCHOOL
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Problems solved by technology
According to the current technical indicators of domestic LTCC manufacturers, the main characteristic size parameters of embedded micro-channels are about 200 μm, and there are series of problems such as difficult processing, cavity wall deformation and collapse in the process of processing cavities with a width greater than 200 μm in LTCC substrates. , the environment of high temperature, low temperature and large temperature difference has a great influence on the LTCC substrate. If the environmental adaptability of the LTCC substrate does not meet the requirements, and the cavity wall of the microchannel is deformed and collapsed, then the electronics packaged with the LTCC substrate The quality and lifespan of the product will also be affected
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[0029] The present invention will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. The present invention can be implemented in many different forms, and is not limited to the embodiments described in this embodiment. The purpose of providing the following specific embodiments is to facilitate a clearer and more thorough understanding of the disclosure of the present invention. However, those skilled in the art may realize that one or more of the specific detailed descriptions may be omitted. In some examples, some implementations The method is not described or not described in detail.
[0030] In addition, the technical features and technical solutions described herein can also be combined in any suitable manner in one or more embodiments. It is readily understood by those skilled in the art that the steps or sequence of operations of methods related to the embodiments provided herein can also be changed. Theref...
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The invention discloses a testing method and apparatus for an LTCC substrate with an inwardly embedded micro channel. The method comprises: initial detection is carried out on an LTCC substrate sample; and low-temperature storage testing, high-temperature storage testing, and high-and-low temperature loop testing are carried out on the LTCC substrate sample after initial detection and the LTCC substrate sample after testing each time is detected. With the method and apparatus, a series of environment item testes like low-temperature storage, high-temperature storage, and temperature circulation are carried out on the LTCC substrate with an inwardly embedded micro channel, thereby detecting a non-destructive quality and a structural integrity situation of the LTCC substrate with an inwardly embedded micro channel and thus obtaining a qualitative conclusion of reliability of the substrate in ground simulation using environment.
Description
technical field [0001] The invention belongs to the field of testing, and in particular relates to a testing method and device for an LTCC substrate embedded with a microflow channel. Background technique [0002] Micro-Electro-Mechanical System (MEMS, Micro-Electro-Mechanical System) is an integrated device of microcircuits and micromachines on a chip according to functional requirements, usually in the millimeter or micron range. And other important fields have been widely used, so the reliability and durability of MEMS devices is particularly important, which directly determines the working quality and life of MEMS devices; at high temperatures, failures caused by alternating mechanical loads often occur in micro-electromechanical systems. Especially those with tiny movable structures made of low-melting materials. There are many factors that affect the quality and life of MEMS. Low temperature co-fired ceramics (LTCC, low temperature co-fired ceramic), as the packaging ...
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IPC IPC(8): G01R31/00G01N21/88G01N29/06
CPCG01N21/88G01N29/0681G01N2291/0232G01N2291/02881G01N2291/0289G01R31/003
Inventor 刘念缪旻金玉丰
Owner PEKING UNIV SHENZHEN GRADUATE SCHOOL