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Non-cyanide electroless gold plating bath and electroless gold plating method

A technology of chemical gold plating and cyanide chemistry, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of plating bath stability and plating reactivity reduction, and achieve the effect of improving reactivity

Active Publication Date: 2017-02-15
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Further, the above-mentioned non-cyanide type gold plating bath, compared with the cyanide gold plating bath, exists the tendency that plating bath stability and plating reactivity decrease easily.

Method used

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Embodiment

[0052] Next, the present invention will be described in detail by citing examples. The present invention is not limited by the following examples, and can be implemented with appropriate changes within the scope of the purpose of adapting the context. These are all included in the technical scope of the present invention.

[0053] [Preparation of samples for film thickness measurement of gold plating, confirmation of corrosion of nickel plating, and appearance observation of gold plating]

[0054] 〔Sample of ENIG process〕

[0055] The samples of the ENIG process used for the film thickness measurement of the above-mentioned gold plating, etc. were obtained by the following method. That is, a TEG wafer made of Al-Cu of an Al-based alloy was prepared as an electrode, and on this electrode, a nickel-plated layer with a thickness of 5.0 μm was formed by an electroless plating method using an electroless nickel plating bath (NPR-18 manufactured by Uemura Industrial Co., Ltd.). , N...

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Abstract

The invention provides a gold plating bath which can be used in gold plating of an ENIG procedure and an ENEPIG procedure. The non-cyanide electroless gold plating bath includes gold salt with water solubility, a reducing agent and a complexing agent. The gold plating bath without cyanide is characterized in that the reducing agent includes formic acid or salt thereof, and hydrazine.

Description

technical field [0001] The invention relates to a cyanide-free chemical gold plating bath and a chemical gold plating method. Background technique [0002] Conventionally, in the mounting process of printed circuit boards or electronic components, there has been an ENIG (Electroless Nickel Immersion Gold) process of forming displacement gold plating on electroless nickel plating as the final surface treatment. This process can be used in welding. In addition, it can also be used for wire bonding by performing thick gold plating after the ENIG process. [0003] On the other hand, the ENEPIG (ElectrolessNickel Electroless Palladium Immersion Gold, Electroless Nickel Electroless Palladium Immersion Gold) process of electroless palladium plating on the substrate electroless nickel plating and gold plating also adopts the above-mentioned final surface treatment. This process is especially suitable for lead-free soldering. Also suitable for wire bonding. [0004] The above-men...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44
CPCC23C18/44C23C18/1637
Inventor 柴田利明田中小百合小田幸典
Owner C UYEMURA & CO LTD