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Non-electrolysis gold plating solution

A gold-plating liquid and base metal technology, which is applied in the direction of electrical components, printed circuits, liquid chemical plating, etc., can solve the problems not mentioned

Inactive Publication Date: 2007-11-07
KANTO CHEM CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0013] And adopt to gold, nickel, palladium etc. have catalysis, combined the reducing agent of hydrazine series and boron-based reducing agent, obtain the gold-plating solution (J.Electrochem.Soc., Vol.138 that can directly plate gold on gold and nickel) , No.4(1991) 976~982, US Patent 4979988), but it is not mentioned that gold plating is carried out through the so-called self-catalysis and substrate metal catalysis. In this gold plating solution, gold plating does not form a specific film thickness by displacement reaction film with excellent adhesion can be obtained

Method used

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Examples

Experimental program
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Effect test

Embodiment 1

[0049] After forming a Ni-P coating film on the copper plate with ICP Nicolon GM manufactured by Okuno Pharmaceutical Industry Co., Ltd. according to the above procedure, electroless gold plating was performed using the solution in Table 1. No. 1.

[0050] Under the condition of stirring at 60° C., dipping for 1 hour resulted in a light yellow semi-glossy gold coating of 0.04 μm. The obtained gold plating film did not peel off in the tape test, had good adhesion, and almost no pores were observed. The substitution reaction rate in terms of Ni eluted amount was 27%. The gold wire bonding strength is also 10 gf or more, which is good.

Embodiment 2

[0052] After forming a Ni-P coating film on the copper plate with ICP Nicolon GM manufactured by Okuno Pharmaceutical Industry Co., Ltd. according to the above procedure, electroless gold plating was performed using the solution in Table 1. No. 2.

[0053] Under the condition of stirring at 60° C., dipping for 1 hour resulted in a light yellow semi-glossy gold coating of 0.68 μm. The obtained gold plated film did not peel off in the tape test, had good adhesion, and no pores were observed at all. The substitution reaction rate converted from the Ni elution amount was 1%.

Embodiment 3

[0055] After forming a Ni-P coating film on the copper plate with ICP Nicolon GM manufactured by Okuno Pharmaceutical Industry Co., Ltd. according to the above procedure, electroless gold plating was performed using the solution in Table 1. No. 3.

[0056] Under the condition of stirring at 60° C., dipping for 1 hour resulted in a light yellow semi-glossy gold coating of 0.08 μm. The obtained gold plating film did not peel off in the tape test, had good adhesion, and almost no pores were observed. The substitution reaction rate converted from the Ni elution amount was 15%.

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Abstract

An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 mug / cm<2>, and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step.

Description

technical field [0001] The present invention relates to an electroless gold plating solution used for forming a gold plating film on electronic industry components such as printed circuit boards. Background technique [0002] The printed circuit board has a metal circuit pattern on the substrate and / or inside the substrate. The circuit is made of low-resistance metals such as copper, and nickel or nickel alloys are also provided to prevent oxidation and corrosion of the copper circuit and / or prevent migration with gold. It also forms a gold coating film aimed at securing nickel oxidation and contact reliability and improving solder wettability. When forming such a circuit, the existing methods are: after the copper pattern is formed, nickel or nickel alloy plating is performed, and either electrolytic gold plating is performed, or autocatalytic gold plating is performed after displacement gold plating, or nickel plating is performed after nickel plating. Thicker displacemen...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44H05K3/24
CPCH05K3/244C23C18/44
Inventor 加藤胜岩井良太
Owner KANTO CHEM CO INC