Unlock instant, AI-driven research and patent intelligence for your innovation.

Cyanide-free chemical gold plating bath and chemical gold plating method

A technology of chemical gold plating and cyanide chemistry, applied in liquid chemical plating, metal material coating process, coating and other directions, can solve the problems of plating bath stability and reduction in plating reactivity, and achieve the effect of improving reactivity

Active Publication Date: 2020-07-21
C UYEMURA & CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Further, the above-mentioned non-cyanide type gold plating bath, compared with the cyanide gold plating bath, exists the tendency that plating bath stability and plating reactivity decrease easily.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cyanide-free chemical gold plating bath and chemical gold plating method
  • Cyanide-free chemical gold plating bath and chemical gold plating method
  • Cyanide-free chemical gold plating bath and chemical gold plating method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0052] Next, the present invention will be specifically described by citing examples. The present invention is not limited by the following examples, and can be implemented with appropriate changes within the scope of the context adapted to the context, and these are all included in the technical scope of the present invention.

[0053] [Preparation of samples for film thickness measurement of gold plating, confirmation of corrosion of nickel plating, and appearance observation of gold plating]

[0054] 〔Sample of ENIG process〕

[0055] The samples of the ENIG process used in the measurement of the film thickness of the gold plating and the like were obtained by the following method. That is, a TEG wafer made of Al-Cu, which is an Al-based alloy, is prepared as an electrode. On the electrode, an electroless nickel plating bath (NPR-18 manufactured by Uemura Industry Co., Ltd.) is used to form a 5.0 μm thick nickel plating method. Next, the electroless gold plating bath shown in Tabl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
tensile loadaaaaaaaaaa
Login to View More

Abstract

The present invention provides a gold plating bath that can be used for gold plating formation in both the ENIG process and the ENEPIG process. The cyanide-free chemical gold plating bath of the present invention contains water-soluble gold salt, reducing agent and complexing agent, and does not contain cyanide. It is characterized in that the reducing agent contains formic acid or its salt, and hydrazines.

Description

Technical field [0001] The invention relates to a non-cyanide chemical gold plating bath and a chemical gold plating method. Background technique [0002] Conventionally, in the mounting process of a printed circuit board or an electronic component, as a final surface treatment, there is an ENIG (Electroless Nickel Immersion Gold) process in which substitution type gold plating is formed on the electroless nickel plating. This process can be used in welding. In addition, by performing thick gold plating after the ENIG process, it can also be used for wire bonding. [0003] On the other hand, the ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) process in which palladium is electrolessly plated on the substrate by electroless nickel plating to form gold plating also adopts the above-mentioned final surface treatment. This process is particularly suitable for lead-free soldering. It is also suitable for wire bonding. [0004] The above-mentioned ENIG process and ENE...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/44
CPCC23C18/44C23C18/1637
Inventor 柴田利明田中小百合小田幸典
Owner C UYEMURA & CO LTD