Method for re-washing solder resist plug hole

Abstract

The invention discloses a method for re-washing a solder resist plug hole, belonging to the technical field of manufacturing of circuit boards. The method comprises the following steps of: (a), putting a plug hole board to be re-washed in a liquid medicine groove containing a swelling agent to immerse and perform swelling treatment; (b), putting the plug hole board immersed by the swelling agent in a water washing groove to wash, and removing the swelling agent on the surface of the board; (c), putting the plug hole board in a re-washing groove containing NaOH solution to immerse; (d), putting the plug hole board processed in the step (c) in the water washing groove to wash; and (e), washing the fetched plug hole board by using a high-voltage water gun, and removing printing ink and NaOH solution on the surfaces of the plug hole and the board. By means of the method disclosed by the invention, solder resist printing ink in the hole of the plug hole board can be effectively removed; and thus, the quality problem that printing ink in small holes cannot be re-washed cleanly after solder resist solidification can be thoroughly solved.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for backwashing solder resist plug holes, which is mainly used for backwashing solder resist ink in the plug holes. Background technique [0002] The plug hole board refers to the circuit board made by ink plug holes for some small holes on the board according to the design requirements of the circuit. With the continuous development of the electronics industry, the requirements for the appearance of circuit boards are becoming more and more stringent. In the solder mask production process, the plug board needs to be inspected after solder mask baking. If the plug hole is found to be defective or other quality problems, it needs to be returned. Wash to reprocess. At present, the traditional method is usually used for backwashing the problem plug orifice plate. The specific operation is as follows: soak the problem plug orifice plate that needs to be rew...

AI Technical Summary

Problems solved by technology

At present, the traditional method is usually used for backwashing the problem plug orifice plate. The specific operation is as follows: soak the problem plug orifice plate that needs to be rewashed and reworked in the cleaning solution, and then take it out and rinse it with a high-pressure water gun. Although this treatment method can remove the problem plug Solder resist layer on the surface of the orifice plate, but the ink in the plug hole with a pore diameter of less than 0.7mm cannot react with the cleaning solution during the soaking process, resulting in the hole being unable to be rinsed clean in the subsequent high-pressure water washing, and the plug hole plate soaking time in the cleaning solution If it is too long, it is easy to damage the resin on the board surface of the circuit board. If it is repeatedly washed, it is easy to have other poor quality problems such as white spots on the board surface or texture patterns.

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