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An electronic hf heating and cooling system

An electronic heating and cooling technology, applied in the field of electronic HF heating and cooling systems, can solve the problems of increased equipment volume and occupied area, difficulty in precise temperature control, and increased equipment failure, so as to improve maintenance performance and improve equipment production The effect of improving efficiency and safety

Active Publication Date: 2019-03-22
冠礼控制科技(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The compressor has low efficiency, high noise and bulky volume
Difficult to maintain and operate
Traditional heating / cooling control consists of separate heating components and cooling components, which are usually independently controlled by independent thermostats. Coordinated control is difficult, and it is difficult to precisely control the temperature
Since the equipment must be equipped with an independent heating system and cooling system at the same time, the probability of equipment failure will increase; the volume and occupied area of ​​the equipment will also increase, and the workload of design, operation and maintenance will increase.

Method used

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  • An electronic hf heating and cooling system
  • An electronic hf heating and cooling system
  • An electronic hf heating and cooling system

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Embodiment Construction

[0023] Below in conjunction with accompanying drawing, the present invention will be further described as follows:

[0024] As shown in the drawings, the present invention includes a heat exchange box 1 equipped with chemical passages. The heat exchange box 1 is made of polytetrafluoroethylene resin. On both sides of the heat exchange box 1, the left and right sides of the heat exchange box 1 are respectively provided with a semiconductor cooling plate 2, a heat conduction plate 3 is provided between the semiconductor cooling plate 2 and the heat exchange box 1, and the other side of the semiconductor cooling plate 2 is provided There is a cooling water tank 4, the upper side of the heat exchange tank 1 is provided with a heat exchange tank chemical liquid outlet 5, the lower side of the heat exchange tank 1 is provided with a heat exchange tank chemical liquid inlet 6, and the side of the cooling water tank 4 is provided with a cooling water tank circulation Port 7, the semic...

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Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to an electronic HF (hydrogen fluoride) temperature increasing and decreasing system which comprises a heat exchange box (1) with a chemical channel. Semiconductor chilling plates (2) are respectively arranged on the left side and the right side of the heat exchange box (1), heat conduction plates (3) arranged among the semiconductor chilling plates (2) and the heat exchange box (1), a cooling water tank (4) is arranged on the other side of each semiconductor chilling plate (2), a heat exchange box chemical liquid outlet (5) is formed in the upper portion of the side surface of the heat exchange box (1), a heat exchange box chemical liquid inlet (5) is formed in the lower portion of the side surface of the heat exchange box (1), cooling water tank circulation ports (7) are formed in the side surfaces of the cooling water tank (4), and the semiconductor chilling plates (2) are connected with a switch power supply through a current control modules. The system abandons a traditional high-temperature quartz / stainless steel heater and an ice compression machine, heating can be achieved, cooling can be also achieved, and safety, maintenance performance and environmental protection performance are improved.

Description

[technical field] [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to an electronic HF heating and cooling system. [Background technique] [0002] In the semiconductor manufacturing process, constant temperature and constant concentration chemicals (such as HF, AL-E, etc.) must be used in the RCA cleaning / etching process to control the cleaning / etching effect to remain stable and consistent. With the advancement of the semiconductor manufacturing process, the requirements for the allowable temperature range are becoming more and more stringent, basically increasing from the original 23±3°C to 23±1°C. Most of the high-purity chemicals currently used for cleaning are heated in chemical tanks with quartz tubes / stainless steel heaters and cooled with compressed ice machines / factory cooling water. Generally speaking, the heating process and the cooling process cannot use common pipelines and heat exchangers, and must be separately...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05D23/24
CPCG05D23/24
Inventor 张仕成赵晗吴玉明姬荟
Owner 冠礼控制科技(上海)有限公司