Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board arrangement and method for mounting a product to a main printed circuit board

A technology for printed circuit boards and products, applied in the structural connection of printed circuits, printed circuits, printed circuits, etc., can solve the problems of expensive steps, time-consuming, and expensive tools, achieve low-cost manufacturing, reduce manufacturing tolerances, and reduce requirements Effect

Active Publication Date: 2017-02-22
SIGNIFY HLDG BV
View PDF6 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Tooling can be expensive and may even require structures for every possible product to be attached
Furthermore, the step of attaching or configuring tooling can be an extra step during assembly of the printed circuit board assembly
Therefore, the required tools and / or steps are expensive and time-consuming

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board arrangement and method for mounting a product to a main printed circuit board
  • Printed circuit board arrangement and method for mounting a product to a main printed circuit board
  • Printed circuit board arrangement and method for mounting a product to a main printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In the detailed description of the invention, embodiments of a printed circuit board arrangement according to the invention are mainly discussed with reference to plan views showing a main printed circuit board or product. It should be noted that this in no way limits the scope of the invention, which is also applicable in other situations, eg with other types of printed circuit boards. In addition, the present invention is mainly discussed using elongated grooves having protrusions in the middle of the side walls of the elongated grooves, however, the present invention can also be applied to cases where the protrusions are located anywhere along the side walls of the elongated grooves. Furthermore, the dimensions and / or number of elongated slots and protrusions shown in the figures are schematic representations only. In use, quantities, dimensions and other such details will be determined by each application.

[0033] The invention will now be described with reference...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).

Description

technical field [0001] The present invention relates to a printed circuit board arrangement and a method for mounting a product to a main printed circuit board at a substantially vertical angle. Background technique [0002] Printed circuit boards have long been used to allow electronics manufacturers and electronics designers to be provided with simple tools for organizing and attaching electronic circuits and components on a platform appropriate for each application. However, since modular designs, replaceable support structures, or components that require additional space are often required, the usual solution is to use one or more secondary boards, which contain the required electronic circuits or components, or to keep the board in A bracket in place (eg, in an industrial setting) within a support structure. Components of such systems (eg daughterboards or brackets) require the main printed circuit board to be held in some way and the daughterboard or bracket introduce...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K3/36
CPCH05K1/141H05K3/366H05K2201/048H05K2201/09081H05K2201/09063H05K1/183H01R12/7023H01R12/737H05K1/11
Inventor N·A·范里杰斯维杰克
Owner SIGNIFY HLDG BV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products